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pro vyhledávání: '"Cheng-Tsai Hsieh"'
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
The design of the millimeter wave antenna in package (AiP) or antenna in module (AiM) makes testing over the air a must. Because of the long test time and the use of the anechoic chambers, a high-efficiency parallel measurement must be performed in m