Zobrazeno 1 - 10
of 126
pro vyhledávání: '"Cheng-Ta Ko"'
Autor:
Tzu-Nien Lee, John-H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Kai-Ming Yang, Puru-Bruce Lin, Chia-Yu Peng, Leo Chang, Jia-Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng
Publikováno v:
Materials, Vol 15, Iss 7, p 2396 (2022)
In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is pl
Externí odkaz:
https://doaj.org/article/a7325ed4b3bb49e9871dd6caee5ba862
Autor:
Tony Chia-Yu Peng, John H. Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Bruce Puru Lin, Tim Xia, Leo Chang, Hsing-Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:469-478
Autor:
Lau, John H.1 john_lau@unimicron.com, Cheng-Ta Ko1, Chia-Yu Peng1, Tzvy-Jang Tseng1, Kai-Ming Yang1, Tim Xia1, Lin, Puru Bruce1, Lin, Eagle1, Leo Chang1, Hsing Ning Liu1, Lin, Curry1, Yan-Jun Fan1, Cheng, David1, Lu, Winnie1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 2, p67-80. 14p.
Autor:
Lau, John H.1 john_lau@unimicron.com, Cheng-Ta Ko1, Chia-Yu Peng1, Kai-Ming Yang1, Tim Xia1, Lin, Puru Bruce1, Jean-Jou Chen1, Po-Chun Huang1, Tzvy-Jang Tseng1, Lin, Eagle1, Leo Chang1, Lin, Curry1, Yan-Jun Fan1, Hsing-Ning Liu1, Lu, Winnie1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 2, p29-39. 11p.
Autor:
Chia-Yu Peng, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wang, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
International Symposium on Microelectronics. 2021:000217-000223
In this study, a high-density organic hybrid substrate for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and characterization of the hybrid substrate with an interconnect-layer.
Autor:
Lau, John H. john_lau@unimicron.com, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Lin, Puru Bruce, Lin, Eagle, Leo Chang, Hsing Ning Liu, Lin, Curry, Cheng, David, Winnie Lu
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Oct2020, Vol. 17 Issue 4, p111-120. 10p.
Autor:
Lau, John H.1 John_Lau@unimicron.com, Cheng-Ta Ko1, Chia-Yu Peng1, Kai-Ming Yang1, Tim Xia1, Puru Bruce Lin1, Jean-Jou Chen1, Po-Chun Huang1, Tzvy-Jang Tseng1, Eagle Lin1, Leo Chang1, Curry Lin1, Winnie Lu1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Jul2020, Vol. 17 Issue 3, p89-98. 10p.
Autor:
Ning Liu, Chia-Yu Peng, Eagle Lin, Curry Lin, Leo Chang, Puru Bruce Lin, Tim Xia, Tzvy-Jang Tseng, John H. Lau, Kai-Ming Yang, Tzu Nien Lee, Show May Chiu, Cheng-Ta Ko
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:739-747
In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED
Autor:
Yan-Jun Fan, John H. Lau, Kai-Ming Yang, Hsing-Ning Liu, Tzvy-Jang Tseng, Eagle Lin, Puru Bruce Lin, Curry Lin, Leo Chang, Jean-Jou Chen, Po-Chun Huang, Cheng-Ta Ko, Tim Xia, Winnie Lu, Chia-Yu Peng
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:29-39
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel i
Autor:
Tim Xia, David Cheng, Kai-Ming Yang, Yan-Jun Fan, Puru Bruce Lin, Tzvy-Jang Tseng, John H. Lau, Winnie Lu, Cheng-Ta Ko, Chia-Yu Peng, Curry Lin, Leo Chang, Hsing Ning Liu, Eagle Lin
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:67-80
In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a print