Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Cheng-Ping Lin"'
Autor:
Cheng-Ping Lin, 林承平
101
The International Association of Research on Cancer has classified the areca nut as a human environmental carcinogen. Previous studies have shown that arecoline (AR) is the major areca nut alkaloid present in the saliva of areca nut chewers.
The International Association of Research on Cancer has classified the areca nut as a human environmental carcinogen. Previous studies have shown that arecoline (AR) is the major areca nut alkaloid present in the saliva of areca nut chewers.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/41987376467055700852
Autor:
Cheng-ping Lin, 林正苹
100
This study interviewed a total of 8 preschool teachers, with 2 from each of the 4 privately managed public preschools the researcher visited. This study used a semi-structured interview protocol to understand preschool teachers’ self-effic
This study interviewed a total of 8 preschool teachers, with 2 from each of the 4 privately managed public preschools the researcher visited. This study used a semi-structured interview protocol to understand preschool teachers’ self-effic
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/04362580671144707022
Autor:
Cheng-ping Lin, 林正平
100
Opportunistic relay improves the performance of transmissions in vehicular WiFi networks, which make data transmitted more effectively in the fleeting and intermittent vehicular networks. However, too many relays may reduce the quality of co
Opportunistic relay improves the performance of transmissions in vehicular WiFi networks, which make data transmitted more effectively in the fleeting and intermittent vehicular networks. However, too many relays may reduce the quality of co
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/12793637378172002098
Autor:
CHENG-PING LIN, 林正彬
92
The purpose of this study is : to have a better understanding of the satisfied degrees of teaching career and teaching beliefs of the teachers in elementary schools; to explore what teachers’ backgrounds will pull out from their satisfied d
The purpose of this study is : to have a better understanding of the satisfied degrees of teaching career and teaching beliefs of the teachers in elementary schools; to explore what teachers’ backgrounds will pull out from their satisfied d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/52323672740073888128
Autor:
Sasaki Daisuke, Kazuki Watanabe, Srinidhi Suresh, Tatsuyoshi Wada, Claudio Alvarez, Naoki Watanabe, Rao Tummala, Madhavan Swaminathan, Cheng Ping Lin, Ryo Nagatsuka
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
High-efficiency High-Voltage Integrated Voltage Regulators (HV-IVR) will allow the next generation of data centers and servers to operate with higher efficiency while delivering more computing power. High-density embedded inductors operating at frequ
Autor:
Rao Tummala, Fuhan Liu, Mohanalingam Kathaperumal, Atsushi Kubo, Naoki Watanabe, Atom Watanabe, Cheng Ping Lin, Pratik Nimbalkar, David Weyers, Madhavan Swaminathan, Fukuya Naohito, Toshiyuki Makita
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Low-stress and low-warpage dielectrics are gaining importance as we move towards large-body Multi-chip Modules (MCMs). This paper demonstrates fabrication of redistribution layer (RDL) with 5 μm linewidth/spacing using a novel low-stress dielectric
Publikováno v:
Applied Economics Letters. 26:370-386
Growth value model (GVM) considers stock intrinsic value as the synergy of book value and return on equity (ROE), which contains two parameters, value factor and growth factor. This study addresses...
Publikováno v:
Advanced Engineering Informatics. 36:178-193
To apply final as-built BIM models to facility management (FM) during the operation phase, it is important for owners to obtain an accurate, final as-built model from the general contractors (GCs) following project closeout. Confirming the accuracy o
Autor:
Atsushi Kubo, Fuhan Liu, Naoki Watanabe, Bartlet H. DeProspo, Cheng Ping Lin, Atom Watanabe, Gaurav Khurana, Rao Tummala, Chandrasekharan Nair, Toshiyuki Makita
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Microvia is the vertical interconnect structure for multi-layer redistribution layers (RDLs) in high-density interconnect (HDI) printed circuit boards (PCBs), HDI package substrates, 2.5D interposers and fan-out packages. Three technologies such as p