Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Cheng Lin Ho"'
Autor:
Masashi Chiba, Craig P. Loomis, Yoshihiko Yamada, Fumiaki Nakata, Yousuke Utsumi, Yutaka Komiyama, Toshifumi Futamase, Yao Cheng Lee, Yoshinori Miwa, Fumihiro Uraguchi, Paul T. P. Ho, Kyoji Nariai, Tomio Kurakami, Takashi Hamana, Yutaka Ezaki, Yoshiyuki Obuchi, Michael A. Strauss, Hideo Yokota, Dun Zen Jeng, Yukiko Kamata, Kazuyuki Kasumi, Satoru Iwamura, Eric J.-Y. Liaw, Naoki Yasuda, Hiroki Fujimori, Satoshi Kawanomoto, Hisanori Furusawa, Noboru Ito, Tadafumi Takata, Hisanori Suzuki, Atsushi J. Nishizawa, Chi Fang Chiu, Yusuke Hayashi, Robert Armstrong, Tomonori Usuda, Makoto Endo, Masamune Oguri, Hitomi Yamanoi, Hiroaki Aihara, Hitoshi Murayama, Robert H. Lupton, Kohei Imoto, Masaharu Muramatsu, Naoto Dojo, Michitaro Koike, Hiroyuki Ikeda, Kotaro Akutsu, Satoshi Miyazaki, Tomohisa Uchida, Satoshi Sofuku, James E. Gunn, Hiroshi Karoji, Masayuki Tanaka, Toru Matsuda, Masayuki Suzuki, Koei Yamamoto, Tomoaki Taniike, Daigo Tomono, Masahiro Takada, Edwin L. Turner, Kunio Takeshi, Yukie Oishi, Hironao Miyatake, Kazuhito Namikawa, H. Nakaya, Shoken Miyama, Tsang Chih Lai, Sogo Mineo, Norio Okada, Manobu M. Tanaka, Naoshi Sugiyama, Tsuyoshi Terai, James Bosch, Paul A. Price, Philip J. Tait, Shiang-Yu Wang, Yuki Okura, Yoshiyuki Doi, Hsin Yo Chen, Yoko Tanaka, Noboru Kawaguchi, Steve Bickerton, Tomoki Morokuma, Steward Smith, Cheng Lin Ho, Yasuhito Miyazaki
Publikováno v:
Publications of the Astronomical Society of Japan. 70
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:577-588
The warpage of glass substrate in chip-on-glass (COG) assemblies were believed to be the main cause of the so-called "Mura" phenomenon in thin-film transistor liquid crystal display (TFT-LCD) panels. The main objective of the study is to characterize
Publikováno v:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 38:12-17
A double-pass mass exchanger with external recycle by inserting a permeable barrier to divide a circular tube into two subchannels of uniform wall concentration, resulting in substantially improving the mass transfer rate, has been investigated theor
Autor:
Cheng-Lin Ho, Chii-Dong Ho
Publikováno v:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 36:81-91
A new device of a double-pass mass exchanger is a circular tube divided by inserting a permeable barrier into two subchannels with uniform wall concentration, resulting in considerable improvement of the device performance in mass transfer compared w
Autor:
Cheng-Lin Ho, 何政霖
102
Orthogonal frequency division multiple access (OFDMA), based on an orthogonal frequency division multiplexing (OFDM) technique, provides high data rates with flexible bandwidth allocation and high spectral efficiency.However, OFDMA systems a
Orthogonal frequency division multiple access (OFDMA), based on an orthogonal frequency division multiplexing (OFDM) technique, provides high data rates with flexible bandwidth allocation and high spectral efficiency.However, OFDMA systems a
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/89w8aj
Publikováno v:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 40:805-807
Autor:
Yao-Cheng Lee, Tsang-Chih Lai, Satoshi Kawanomoto, Fumihiro Uraguchi, Dun-Zen Jeng, Yousuke Utsumi, Satoru Iwamura, Yukiko Kamata, Shiang-Yu Wang, Yutaka Komiyama, Eric J.-Y. Liaw, Cheng-Lin Ho, Satoshi Miyazaki, Hidehiko Nakaya, Chi-Fang Chiu, Tomoki Morokuma, Hsin-Yo Chen
Publikováno v:
SPIE Proceedings.
We have developed a filter exchange unit (FEU) and a shutter of Hyper Suprime-Cam (HSC). FEU consists of two parts; the alignment mechanism of the filter in the optical path and a jukebox of the filters. The alignment mechanism can guarantee 10 μm p
Autor:
Cheng-Lin Ho, 何承霖
99
This study is to investigate the thin metallic PEM fuel cell power generation system by designing and manufacturing in three different directions. First is the surface treatment of SS304 bipolar plate, by using the peck cementation process fo
This study is to investigate the thin metallic PEM fuel cell power generation system by designing and manufacturing in three different directions. First is the surface treatment of SS304 bipolar plate, by using the peck cementation process fo
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/69094124622985553148
Autor:
Cheng-Lin Ho, 何丞林
92
Nowadays, the favor of electronic devices with diverse functions, portability and very high performance has pushed the design of IC packages to a new era with higher I/O densities, smaller packaging size, and faster operation frequency. The c
Nowadays, the favor of electronic devices with diverse functions, portability and very high performance has pushed the design of IC packages to a new era with higher I/O densities, smaller packaging size, and faster operation frequency. The c
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/60183020225977678456
Publikováno v:
IEEE Transactions on Components & Packaging Technologies. Sep2006, Vol. 29 Issue 3, p577-588. 12p. 4 Black and White Photographs, 5 Charts, 12 Graphs.