Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Chender Huang"'
Cavity-down thermal-enhanced package reliability evaluation for low-k dielectric/Cu interconnects IC
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
It has been well recognized that IC packaging materials have a great impact on the IC chip integrity of chips fabricated by low dielectric constant inter-metal-dielectric (Low-k IMD) materials. To understand the effect of the package process and mate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::573852f99157109b996ed792e262e849
https://doi.org/10.1109/ectc.2004.1319061
https://doi.org/10.1109/ectc.2004.1319061
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Due to low dielectric constant inter-metal-dielectric (low-k IMD) materials possessing weaker mechanical properties and higher coefficient of thermal expansion (CTE) compared with IC silicon substrates, the integrity of advanced IC low-k IMD layer/si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a002d6ed67f363e0a44394f8bbe1bb73
https://doi.org/10.1109/ectc.2004.1319423
https://doi.org/10.1109/ectc.2004.1319423
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
46-ball /spl mu/BGA packages assembled by two different packaging methodologies, one utilizing nubbin structure (type A) and the other using pre-made elastomer film (type B), were investigated for the evaluation of the manufacturing induced stresses
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cb3b2033817a134d4d4d8baad722bd0
https://doi.org/10.1109/ectc.1999.776248
https://doi.org/10.1109/ectc.1999.776248
Publikováno v:
1997 Proceedings 47th Electronic Components and Technology Conference.
This paper introduces an integrated design and analysis CAD tool for SSO noise in PQFP leadframe packages. The CAD tool incorporates very efficient design and analysis algorithms which enable an accurate estimate of the maximum Simultaneous Switching
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::237df58c59f1179fc692cd23219d2540
https://doi.org/10.1109/ectc.1997.606247
https://doi.org/10.1109/ectc.1997.606247
Autor:
Emilio Panarella, Wen-Chieh Tang, Oleg G. Semyonov, Xiaoming Guo, Frank F. Wu, Kazimierz W. Wirpszo, Meisheng Xu, Chender Huang, L. Klibanov
Publikováno v:
SPIE Proceedings.
The VSX is essentially a miniature discharge capable of emitting soft X-ray radiation. Because the radiation is emitted in small dose in each spark, it is necessary to repeat the phenomenon at high frequency in order to achieve the industrial through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40dd1f6981abb369f87336e747e7fb80
https://doi.org/10.1117/12.390113
https://doi.org/10.1117/12.390113
Publikováno v:
1999 Proceedings 49th Electronic Components & Technology Conference (Cat No99CH36299); 1999, p653-656, 4p
Publikováno v:
1997 Proceedings 47th Electronic Components & Technology Conference; 1997, p696-703, 8p
Conference
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Conference
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Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1191-1191, 1p