Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Chen-Tsai Yang"'
Publikováno v:
SID Symposium Digest of Technical Papers. 52:1315-1317
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03037da70bc85e90fd102f7a7c37eedd
https://doi.org/10.1002/sdtp.14944
https://doi.org/10.1002/sdtp.14944
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-out wafer/panel level package (FOWLP/ FOPLP) technology has been demonstrated widely in wearable electronics and flexible hybrid electronics (FHE). Previously, electromigration (EM) mainly has been discussed on the related FOWLP/FOPLP interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::015cf8813c5d0982556f9c5a650c119f
https://doi.org/10.1109/ectc32862.2020.00289
https://doi.org/10.1109/ectc32862.2020.00289
Autor:
Wei-Yuan Cheng, Shau-Fei Cheng, Chen-Tsai Yang, Wei-Han Chen, Hsin-Cheng Lai, Tai-Jui Wang, Yuh-Zheng Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Flexible Hybrid Electronics (FHE) is in the limelight for next generation electronics, it has good potential for further development as the priority areas for focused study, not only can it create new products, but also meet the needs of flexible, be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3607728d37be572551f72e293a999ce4
https://doi.org/10.1109/ectc.2019.00289
https://doi.org/10.1109/ectc.2019.00289
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
FOPLP is attracted more and more attention because it was carried out in panel form for cost-effective products. In this paper, for Chip-last FOPLP manufacturing, we proposed to utilize LCD facilities as well as panel-form plating equipment for RDL m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f1fdf7c21b3a656d7081283bdc44a12
https://doi.org/10.1109/ectc.2018.00065
https://doi.org/10.1109/ectc.2018.00065