Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Chen Y. Wang"'
Publikováno v:
Am J Public Health
Cook County Health partnered with the Chicago Departments of Public Health and Family & Support Services and several dozen community-based organizations to rapidly establish a temporary medical respite shelter during the spring 2020 COVID-19 peak for
The papain-like protease (PLpro) of SARS-CoV-2 is a validated antiviral drug target. Through a fluorescence resonance energy transfer-based high-throughput screening and subsequent lead optimization, we identified several PLpro inhibitors including J
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::15f9ece8ecd5a596d805bde3869cb913
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:2980730
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:2980730
Publikováno v:
Womens Health Issues
Introduction Research on maternal birth outcomes rarely includes postpartum complications with longitudinally linked patient data. We analyze characteristics associated with delivery complications and postpartum hospital use. Methods This population-
Publikováno v:
Am J Obstet Gynecol MFM
BACKGROUND There are few population-based studies of antepartum emergency department visits and inpatient hospitalizations and their implications for delivery outcomes. OBJECTIVE The study aimed to analyze the likelihood of pregnant patients's antepa
Purpose: To investigate age-related differences in outcomes of critically ill patients with sepsis around the world. Methods: We performed a secondary analysis of data from the prospective ICON audit, in which all adult ( >16 years ) patients admitte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::582cc37edaae6b85878afbfc95ac6c91
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3184305
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3184305
Publikováno v:
Safety and Reliability: Methodology and Applications ISBN: 9780429226823
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9afdac991a8775340b87f34e87c3654
https://doi.org/10.1201/b17399-270
https://doi.org/10.1201/b17399-270
Publikováno v:
Journal of Electronic Packaging. 115:201-207
Recent progress in bonding materials is briefly reviewed with highlights of some of the advantages and disadvantages of the various attachment processes. The principle and experimental results of bonding with multilayer structures of Au-Sn and Au-In
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:311-316
A bonding method using Au-In alloy which requires a low process temperature of 200 degrees C to produce high temperature (454 degrees C) bonds is reported. Multiple layers of Au and In are deposited on semiconductor wafers in one vacuum cycle to redu
Publikováno v:
Thin Solid Films. 223:276-287
AuSn eutectic alloy has been successfully used in microelectronic packaging for high reliability applications where a hard solder as well as a low processing temperature are required. A new multilayer bonding technology not only has produced nearl
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:789-793
Lead-indium-gold multilayer composite solder has been developed for bonding electronic devices without the use of flux. The composite is deposited directly on GaAs wafers in high vacuum to inhibit indium oxidation. The gold layer on the composite fur