Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chen Tung Hung"'
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Scaling of TEM specimen thickness is vital to avoid overlapped semiconductor device structures due to the shrinking of device geometry and to obtain good high-resolution TEM images. Nevertheless, thinner TEM specimen fabricated by conventional ex-sit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e1419907052c8920063b7d06b6931e5
https://doi.org/10.1109/ipfa.2015.7224349
https://doi.org/10.1109/ipfa.2015.7224349
Autor:
Liao, Wen-Shiang, Lin, Hsin-Hung, Liu, Yu-Huan, Tang, Mao-Chyuan, Huang, Sheng-Yi, Wu, Cheng-Han, Liaw, Yue-Gie, Chen, Tung-Hung, Shih, Tommy, Chen, Kun-Ming
Publikováno v:
Proceedings of SPIE; Nov2008 Part 2, Issue 1, p69233Y-69233Y-7, 7p
Autor:
Liao, Wen-Shiang, Wu, Cheng-Han, Tang, Mao-Chyuan, Huang, Sheng-Yi, Shih, Tommy, Liaw, Yue-Gie, Chen, Kun-Ming, Chen, Tung-Hung, Tsen, Huan-Chiu, Chung, Lee
Publikováno v:
Proceedings of SPIE; Nov2008, Issue 1, p69212N-69212N-6, 6p
Autor:
Liao, Wen-Shiang, Liu, Yu-Huan, Chang, Wen-Tung, Chen, Tung-Hung, Shih, Tommy, Tsen, Huan-Chiu, Chung, Lee
Publikováno v:
Proceedings of SPIE; Nov2007 Part 2, Issue 1, p65204N-65204N-5, 5p
Autor:
Liao, Wen-Shiang, Chen, Tung-Hung, Lin, Hsin-Hung, Chang, Wen-Tung, Shih, Tommy, Tsen, Huan-Chiu, Chung, Lee
Publikováno v:
Proceedings of SPIE; Nov2007 Part 2, Issue 1, p65204P-65204P-6, 6p
Publikováno v:
Hepatology International; Feb2016 Supplement, Vol. 10, p1-506, 506p
Autor:
Chen, Ming‐Yao, Liu, Chen‐Hua, Chen, Ting‐Chih, Su, Tung‐Hung, Chen, Pei‐Jer, Chen, Ding‐Shinn, Kao, Jia‐Horng, Liu, Chun‐Jen
Publikováno v:
Journal of Gastroenterology & Hepatology; Jan2014, Vol. 29 Issue 1, p102-109, 8p
Autor:
Lin, Jung-Chun, Hsieh, Tsai-Yuan, Wu, Chia-Chun, Chen, Peng-Jen, Chueh, Tung-Hung, Chang, Wei-Kuo, Chu, Heng-Cheng
Publikováno v:
Calcified Tissue International; Dec2012, Vol. 91 Issue 6, p423-429, 7p
Publikováno v:
19th International Conference on Advanced Information Networking & Applications (AINA'05) Volume 1 (AINA papers); 2005, p967-967, 1p