Advanced system in package with fan-out chip on substrate.

Autor: Yuan-Ting Lin, Hsieh, Brian CC, Lou, JW, Chen, Eatice, Chiyu Wang, Tsai, Lung, Hsieh, Adren

Publikováno v: 2015 10th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2015, p273-276, 4p