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Publikováno v:
Microelectronics Reliability. 43:741-749
In the flip-chip ball grid array (FCBGA) assembly process, no-flow underfill has the advantage over traditional capillary-flow underfill on shorter cycle time. Reliability tests are performed on both unmolded and molded FCBGA with three different typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dec6ce38678e58bbc823113bad3a8224
https://doi.org/10.1016/s0026-2714(03)00035-0
https://doi.org/10.1016/s0026-2714(03)00035-0
