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Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
This paper explores the electrical performance of several multi-channel TSV designs i.e. cross-etched full-plated TSV and cross-etched partial-plated TSV to further improve data transmission bandwidth among the vertically stacked silicon devices. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48c2aecd301f9c8104c3a84cfb3d79ab
https://doi.org/10.1109/eptc.2013.6745684
https://doi.org/10.1109/eptc.2013.6745684
