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Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
As microprocessor market is expanding and moving toward tablet and smart phone segment, the conventional power integrity design practice which is placing package and board capacitor to stabilize voltage supply is no longer a favorable solution. Due t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fc7b8f96d2c284af904e8aae6db7e9b
https://doi.org/10.1109/icep-iaac.2015.7111109
https://doi.org/10.1109/icep-iaac.2015.7111109
