Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Chee, Choong Kooi"'
Publikováno v:
In Journal of Photochemistry & Photobiology, A: Chemistry 2006 180(1):1-8
Autor:
Chee Choong Kooi, H. Md. Akil, Kamarshah Ariffin, Mohd Fadli Ahmad Rasyid, Erfan Suryani Abdul Rashid
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications. 225:160-169
This article reports the effects of silane coupling agent (3-aminopropyl triethylsilane) on alumina particles, which were subsequently used as filler for an epoxy resin matrix. Fourier transform infrared spectroscopy was used to study the interaction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60800868f3acc2c88be8eb1b2ebe90f9
https://doi.org/10.1177/0954420711403214
https://doi.org/10.1177/0954420711403214
Autor:
Kamarshah Ariffin, Erfan Suryani Abdul Rashid, Chee Choong Kooi, Hazizan Md Akil, Mohd Fadli Ahmad Rasyid
Publikováno v:
Applied Clay Science. 52:295-300
This paper reports the effect of ion exchange treatment of muscovite particles on the properties of muscovite filled epoxy composites. Ion exchange treatment was performed in order to improve the muscovite-epoxy interfacial adhesion and dispersion in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b7e077a04a04389b5b124023ae28ef0
https://doi.org/10.1016/j.clay.2011.03.008
https://doi.org/10.1016/j.clay.2011.03.008
Publikováno v:
Materials & Design. 30:1-8
This paper reports the preparation and properties of polyhedral oligomer silsesquioxanes (POSS)/epoxy composites. Two compositions of POSS by volume, typically at 1% and 2% were used as filler in epoxy matrix. The composites were studied in terms of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ddf3cfc9da0a75ffcc97b50ed0a7703
https://doi.org/10.1016/j.matdes.2008.04.065
https://doi.org/10.1016/j.matdes.2008.04.065
Publikováno v:
Journal of Reinforced Plastics and Composites. 27:1573-1584
Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54bbb8fb2d79097b14063dbaa908e87e
https://doi.org/10.1177/0731684407086328
https://doi.org/10.1177/0731684407086328
Autor:
Dennis Prem Kumar Chandran, null Sow, null Yeek Kooi, null Mohd Hasri Mohd Harizan, Chee Choong Kooi, null Teoh Teik Hoy, null Chong Kim Foong
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
The Intel Malaysia Electronic Packaging Higher Education Program Team is proudly one of the teams to benchmark among the industry for their engagement with Malaysian universities. This team was formed with the objective of collaborating with Malaysia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e56e81000b55554588354a578c49319f
https://doi.org/10.1109/iemt.2010.5746684
https://doi.org/10.1109/iemt.2010.5746684
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
This article describes the thermal and mechanical behavior of alumina-filled epoxy composites. The epoxy matrix was reinforced with increasing amount of alumina particles in the range of 10-30% by weight using resin transfer molding technique. From t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::368abdd77f1616768b4c28cf7e33ef5c
https://doi.org/10.1109/iemt.2006.4456467
https://doi.org/10.1109/iemt.2006.4456467
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
This paper focuses on the exposed-die molded underfill (MUF) and overmold as underfill (OMUF) technologies for flip chip in the form of a molded matrix array package. A series of mold compounds were selected for this evaluation. MUF and OMUF parts we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e699f6a0c45e04dfb961d481571f1eef
https://doi.org/10.1109/eptc.2004.1396683
https://doi.org/10.1109/eptc.2004.1396683
Autor:
Ng Cheong Huat, Chee Choong Kooi, Shanggar Periaman, E. Then, Lim Szu Shing, J. Chui, Low Mun Fai
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
This paper discusses the work on capillary underfill and mold technology to assemble exposed die backside Flip Chip Molded Matrix Array. Parts were successfully assembled and subjected to reliability stress test. The interaction between capillary und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b869940df949acf3ad406850781fc084
https://doi.org/10.1109/eptc.2003.1271539
https://doi.org/10.1109/eptc.2003.1271539