iNEMI Roadmap For Solid State Illumination.

Autor: Chason, M., Fu, H.

Publikováno v: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p1393-1397, 5p

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X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards.

Autor: Hong, J., Chason, M.

Publikováno v: Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle; 1988, p149-154, 6p

Kinetic interactions of copper, lead and tin on solder coated PC boards studied using X-ray diffraction.

Autor: Chason, M., Hong, J.

Publikováno v: Proceedings Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,; 1989, p294-299, 6p

Observations of the prevacancy temperature dependence of positron annihilation in copper.

Autor: Smedskjaer, L C, Fluss, M J, Siegel, R W, Chason, M K, Legnini, D G

Publikováno v: Journal of Physics F: Metal Physics; 1980, Vol. 10 Issue 4, p559-569, 11p