Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Charlie Reynolds"'
Autor:
Andrea Leigh, Nigel Mills, Olu Wilkey, Ain Satar, Kamla Pillay, Rosemary Roberts, Charlie Reynolds, Colette Datt, Janine Younis
Publikováno v:
BMJ Paediatrics Open, Vol 6, Iss Suppl 1 (2022)
Externí odkaz:
https://doaj.org/article/7f4180a4cbe84dfea534c09173324750
Autor:
Masahiro Fukui, Charles F. Carey, Teruya Fujisaki, Hilton T. Toy, Kenji Terada, Masaaki Harazono, Sushumna Iruvanti, Tomoyuki Yamada, Brian R. Sundlof, Yi Pan, Kamal K. Sikka, Charlie Reynolds, Rebecca N. Wagner
Publikováno v:
International Symposium on Microelectronics. 2014:000068-000073
In organic packages, large die and large laminate body sizes are susceptible to CTE (coefficient of thermal expansion) mismatch driven warpage, stresses and strains, which can result in C4 white bumps, micro Ball Grid Array (BGA) interconnection issu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdfa88efb9a73491c0c89971a5a9fd29
https://doi.org/10.4071/isom-ta31
https://doi.org/10.4071/isom-ta31
Autor:
Tomoyuki Yamada, Fumio Kumokawa, Hiroyuki Fukushima, Jeff Coffin, Sushumna Iruvanti, Shidong Li, Tuhin Sinha, Charlie Reynolds, Hai P. Longworth, Michio Ohori
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The demands for the next generation organic laminate materials include high speed signal (HSS) performance enhancements as well as improvements in bond and assembly processing yields. A typical organic laminate structure consists of one or more layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4490d7d021d3ccf7a358f9aabc15084
https://doi.org/10.1109/ectc.2016.259
https://doi.org/10.1109/ectc.2016.259
Autor:
Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, Patrick Roubaud
Publikováno v:
Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing
This chapter contains sections titled: Introduction Approach and Strategy Observations and Results Conclusions Summary Acknowledgments References ]]>
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9ee398a49fd3de6c4c0e89b333a7172
https://doi.org/10.1002/9780470171479.ch9
https://doi.org/10.1002/9780470171479.ch9
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
A team of NEMI companies collaborated for three years to develop Pb-free assembly and rework processes for double-sided, 14-layer, printed circuit boards (PCB) in two thicknesses (0.093" and 0.135") with electrolytic NiAu and immersion Ag surface fin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d01b44cf5618edc4265fd0ceb2de579e
https://doi.org/10.1109/ectc.2005.1441388
https://doi.org/10.1109/ectc.2005.1441388