Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Charles Tsai"'
Autor:
Jacob S. Levy, Erman Timurdogan, Yu-Sheng Kuo, Gap Youl Lyu, Charles Tsai, Xuejin Yan, Harqkyun Kim, Cristian Stagarescu, Kevin Meneou, Abu Thomas, Ioannis Fragkos, Geoffrey Sitwell, Andrea Trita, Yangyang Liu, Melissa Ziebel, Jerry Byrd, Sven Steinbach, Bruce Chou, William Vis, Arin Abed, Young Kwon, Henri Nykänen, Shih-Han Lo, Janne Ikonen, Juha Larismaa, John Drake, Albert Benzoni, Cyriel Minkenberg, Thomas Schrans, Andrew Rickman
Publikováno v:
Journal of Lightwave Technology. :1-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11705984f50f3750ac44a5fb99717c23
https://doi.org/10.1109/jlt.2023.3263069
https://doi.org/10.1109/jlt.2023.3263069
Publikováno v:
2018 IEEE CPMT Symposium Japan (ICSJ).
High bandwidth signal transmission between ASIC and memory is more and more important especially for high performance Cell Phone Application Processor (AP) application. Several advanced packaging technologies are developed and High bandwidth Package
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5add839efbe5ec45e11c368c1b5eadc
https://doi.org/10.1109/icsj.2018.8602768
https://doi.org/10.1109/icsj.2018.8602768
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Wafer Level Chip Scale Package (WLCSP) has been widely used in MEMS and SiP packages; application of mobile and consuming products. It advantages in lightweight, reducing manufacturing cost, low I/O density and high performance because the bumps dire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaeb2c72ff67a07a5f118192016f2812
https://doi.org/10.1109/impact.2016.7800016
https://doi.org/10.1109/impact.2016.7800016
Publikováno v:
SPIE Proceedings.
Embedded defect types continue to be a challenge for scanning electron microscopes (SEM) review solutions. Though high energy beams can be used to image these defect types, they cause damage to the reviewed sites. Also, imaging all review sites at hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4de4589749bfa88f41e2a92bbb19df5
https://doi.org/10.1117/12.2086505
https://doi.org/10.1117/12.2086505
Publikováno v:
Electric Power Systems Research. 70:1-6
In this paper, a new control algorithm for active power line conditioner (APLC) is proposed. The proposed APLC contains two power converters, a series power converter and a shunt power converter. The series power converter is operated as a current so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f42a24daf6dd57d8f7bc2aba7cea2ea8
https://doi.org/10.1016/j.epsr.2003.10.010
https://doi.org/10.1016/j.epsr.2003.10.010
Publikováno v:
8th International Conference on Power Electronics - ECCE Asia.
This paper presents two flux compensation designs for the uninterruptible power supply system. The objective of the flux compensation is to reduce the potential inrush current of the uninterruptible power supply-fed load transformer in the event of g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f18e2132f6507a6c9eb08b682cebf17
https://doi.org/10.1109/icpe.2011.5944706
https://doi.org/10.1109/icpe.2011.5944706
Publikováno v:
Globalisation and Emerging Economies ISBN: 9789264044807
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8eec6f4a116718d0ee9afbcea8d7c677
https://doi.org/10.1787/9789264044814-12-en
https://doi.org/10.1787/9789264044814-12-en
Publikováno v:
Genetic Engineering ISBN: 9781461570837
Recent advances in the purification of DNA-binding proteins have been due primarily to the use of the specific sequence of the binding site as a ligand for affinity chromatography. Different variations of this basic principle have been developed in s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e8db80c1a5bb9644ada4bbe385b80e4
https://doi.org/10.1007/978-1-4615-7081-3_3
https://doi.org/10.1007/978-1-4615-7081-3_3
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Conference
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