Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Charles Regard"'
Autor:
Kaspar M. B. Jansen, Hélène Fremont, M.A. Xiaosong, Patrick Poirier, Charles Regard, Christian Gautier
Publikováno v:
Microelectronics Reliability. 49:958-962
For the purpose of rapidly identifying the functional weak points of SiP products and defining appropriate design rules, a new methodology is proposed to achieve fast reliability qualification. This new methodology is based on the moisture absorption
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8bcbc2b23054137863bc54f34622f63
https://doi.org/10.1016/j.microrel.2009.07.042
https://doi.org/10.1016/j.microrel.2009.07.042
Autor:
Mohamed Ketata, Maxime Fontaine, Hubert Polaert, Philippe Eudeline, Charles Regard, Christian Gauthier, Olivier Latry, Eric Joubert
Publikováno v:
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
In this paper is presented a new approach for measuring physical values of micro-electronic compounds. Indeed an optical system is used to quantify simultaneously surface temperature and expansion of a component. This is done with a Michelson interfe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ebb01014866d0311acc2de5eadc53fb
https://doi.org/10.1109/stherm.2011.5767201
https://doi.org/10.1109/stherm.2011.5767201
Autor:
L.J. Ernst, Guoqi Zhang, Christian Gautier, O. van der Sluis, W.D. van Driel, Hélène Fremont, Kaspar M. B. Jansen, Xiaosong Ma, Charles Regard
Publikováno v:
Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Bordeaux, France, 1-8
STARTPAGE=1;ENDPAGE=8;TITLE=Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Bordeaux, France
STARTPAGE=1;ENDPAGE=8;TITLE=Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Bordeaux, France
Interface delamination is one of the most important issues in the microelectronic packaging industry. Silver filled die attach is a typical adhesive used between the die and copper die pad for its improved heat dissipation capacity. Delamination betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0c2bf28c354eb4a2219d9c9a49db46f0
https://research.tue.nl/en/publications/d853bbbf-01e1-4090-86e7-a7916da04a32
https://research.tue.nl/en/publications/d853bbbf-01e1-4090-86e7-a7916da04a32
Autor:
Xiaosong Ma, O. van der Sluis, Charles Regard, L.J. Ernst, Guoqi Zhang, Hélène Fremont, W.D. van Driel, Kaspar M. B. Jansen, Christian Gautier
Publikováno v:
Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging 2009 (ICEPT-HDP '09), 10-13 August 2009, Beijing, China, 1206-1211
STARTPAGE=1206;ENDPAGE=1211;TITLE=Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging 2009 (ICEPT-HDP '09), 10-13 August 2009, Beijing, China
STARTPAGE=1206;ENDPAGE=1211;TITLE=Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging 2009 (ICEPT-HDP '09), 10-13 August 2009, Beijing, China
Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take very long time. For example, moisture sensitivity level assess
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5da219d5f4a19dc2479cfb1d7f34c568
https://doi.org/10.1109/icept.2009.5270620
https://doi.org/10.1109/icept.2009.5270620
Autor:
A. Val, Patrick Poirier, Charles Regard, P. Schwindenhammer, Hélène Fremont, F. Roullier, Christian Gautier
Publikováno v:
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
In this paper the solder fatigue of WLCSP (wafer level chip scale packages) assemblies is studied and a comparison with flip chip BGA is made. Previous works have already shown that for BGA, the most critical parameters are size, thickness, and under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aea5b3758af4cf4de14b4b981152ab8d
https://doi.org/10.1109/esime.2008.4525100
https://doi.org/10.1109/esime.2008.4525100
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a3ba23cdebce08df469fdfb43bd56767
https://hal.archives-ouvertes.fr/hal-00323432
https://hal.archives-ouvertes.fr/hal-00323432