Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Charles P. Todd"'
Autor:
Robin Hale, Jian D. L. Yen, Charles R. Todd, Ivor G. Stuart, Henry F. Wootton, Jason D. Thiem, John D. Koehn, Zeb Tonkin, Jarod P. Lyon, Michael A. McCarthy, Tomas J. Bird, Ben G. Fanson
Publikováno v:
Ecosphere, Vol 14, Iss 9, Pp n/a-n/a (2023)
Abstract Models based on ecological processes (process‐explicit models) are often used to predict ecosystem responses to environmental changes or management scenarios. However, models are imperfect and need to be validated, ideally by testing their
Externí odkaz:
https://doaj.org/article/d7ea918bbf43408ea71e824402327c5e
Autor:
Charles P. Todd, Aswin N. Mehta, Omar Diaz de Leon, Daniel Gobled, Kendall S. Wills, James Grund, Rand B. Carawan, Sundari Nagarathnam, Willmar E. Subido, Kartik Ramanujachar, Siva Kolachina, Tim Nagel, Christine Charpentier
Publikováno v:
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis.
Optical waveform probing is a critical component in flipchip diagnostics. There is a dramatic increase in the need for backside silicon probing of non-flipchip packaged devices. The effective way to implement this strategy is to package the die in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35e6c473488776a7a1167044f3841ae8
https://doi.org/10.31399/asm.cp.istfa2001p0051
https://doi.org/10.31399/asm.cp.istfa2001p0051
Publikováno v:
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis.
In the current generations of devices the die and its package are closely integrated to achieve desired performance and form factor. As a result, localization of continuity failures to either the die or the package is a challenging step in failure an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e76c1dc591f1e18d29bf803d10bc58fc
https://doi.org/10.31399/asm.cp.istfa2001p0069
https://doi.org/10.31399/asm.cp.istfa2001p0069
Autor:
G. Wilhite, S. V. Pabbisetty, L. Hughes, D. Davis, Charles P. Todd, J. Widaski, Kendall S. Wills, P. Scott, O. Diaz de Leon, Jianbai Zhu, R. R. Parker
Publikováno v:
International Symposium for Testing and Failure Analysis.
The advent of Flip Chip and other complex package configurations and process technologies have made conventional failure analysis techniques inapplicable. This paper covers the ways in which conventional techniques have been modified to meet the FA c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e357c787f77b2d0289fe6c066bd24003
https://doi.org/10.31399/asm.cp.istfa1998p0472
https://doi.org/10.31399/asm.cp.istfa1998p0472
Publikováno v:
International Symposium for Testing and Failure Analysis.
This article analyzes the cause of Vcc shorts in advanced microprocessors. In one instance, an advanced microprocessor exhibited Vcc shorts at wafer sort in a unique pattern. The poly silicon was narrow in one section of the die. The gates were shown
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca10f375585ad00ca4453cf35a11e4bb
https://doi.org/10.31399/asm.cp.istfa1998p0041
https://doi.org/10.31399/asm.cp.istfa1998p0041
Autor:
Rohini Raghunathan, Chris Carty, Kendall S. Wills, Jianbai Zhu, Philip Simon, Andy Vance, John H. Abbott, Charles P. Todd
Publikováno v:
International Symposium for Testing and Failure Analysis.
Flip Chip packaging requires an understanding of the solder bump metallurgy and its aging characteristics. In this paper we demonstrate how standard failure analysis techniques can help determine aging characteristics and, how an understanding of bum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::526beca0f3d61d9a4032414cf1426b80
https://doi.org/10.31399/asm.cp.istfa1998p0413
https://doi.org/10.31399/asm.cp.istfa1998p0413
Publikováno v:
International Symposium for Testing and Failure Analysis.
Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b42b5c0604697b3a882e947ff7a4d23
https://doi.org/10.31399/asm.cp.istfa1996p0277
https://doi.org/10.31399/asm.cp.istfa1996p0277
Autor:
CHARLES S. TODD
Publikováno v:
Journal of College Student Retention: Research, Theory & Practice; 2004/2005, Vol. 6 Issue 2, p209-224, 16p