Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Charles J. Vath"'
Autor:
Charles J. Vath, Richard Holliday
Publikováno v:
ECS Transactions. 34:843-855
The semiconductor industry has maintained an average 15% cost down per year over the range of products it offers. Continued cost reduction will be difficult to achieve based on current practices and raw material prices. The need to remain competitive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1a363a2293f6d9902d136452d34b645
https://doi.org/10.1149/1.3567682
https://doi.org/10.1149/1.3567682
Publikováno v:
Microelectronics Reliability. 51:137-147
This paper presents the findings of work performed on 20-μm diameter copper wire of five different wire types from three suppliers. Gold wire is the control. The test die was mounted on BT (B (Bismaleimide) and T (Triazine)) resin substrates. The bo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1776c82d21a18294e4d667aa9d9aca26
https://doi.org/10.1016/j.microrel.2010.06.015
https://doi.org/10.1016/j.microrel.2010.06.015
Publikováno v:
Microelectronic Engineering. 85:440-443
The idea of using low-k materials compared to conventional silica (SiO"2) poses a large challenge to the back end processes such as wire bonding. In this study, numerical methods such as finite element method is used to characterize the permissible c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8546dd79f9fa5d99593b6170337b6ed1
https://doi.org/10.1016/j.mee.2007.08.008
https://doi.org/10.1016/j.mee.2007.08.008
Publikováno v:
Journal of Materials Science. 42:615-623
Fine copper wire bonding is capable of making reliable electrical interconnections in microelectronic packages. Copper wires of 0.8–6 mil diameter have been successfully bonded to different bond pad metallized and plated substrate materials such as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8639a907c10502a204404cf7a7a652cb
https://doi.org/10.1007/s10853-006-1148-7
https://doi.org/10.1007/s10853-006-1148-7
Publikováno v:
Thin Solid Films. 504:397-400
Moisture ingression in plastic packages essentially occurs through delaminated interfaces. Hence, package reliability depends on the interfacial integrity between the various materials. In the present work, the adhesion of epoxy-based molding compoun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1959e8e20e8ac5c117a590e174dae5e7
https://doi.org/10.1016/j.tsf.2005.09.100
https://doi.org/10.1016/j.tsf.2005.09.100
Publikováno v:
Microelectronics Reliability. 46:467-475
Thermosonic bonding process is a viable method to make reliable interconnections between die bond pads and leads using thin gold and copper wires. This paper investigates interface morphology and metallurgical behavior of the bond formed between wire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42417f12a830ce5e6b42cd6919da1d90
https://doi.org/10.1016/j.microrel.2005.05.011
https://doi.org/10.1016/j.microrel.2005.05.011
Publikováno v:
Journal of Electronic Packaging. 128:192-201
In microelectronic packaging technology wire bonding is a common interconnect technique. The quality and reliability of wire bonds are generally evaluated by ball shear and stitch pull testing. From the load versus time and load versus tool tip displ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7287ba0dbdc316da8b7370c83f580197
https://doi.org/10.1115/1.2229214
https://doi.org/10.1115/1.2229214
Publikováno v:
Materials Letters. 58:3096-3101
Thermosonic bonding process is a viable method to make reliable interconnections between die bond pads and leads using thin gold and copper wires. This paper investigates interface morphology and metallurgical behavior of the bond formed between wire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd26c8c0e3496a32497f2d29bec75280
https://doi.org/10.1016/j.matlet.2004.05.070
https://doi.org/10.1016/j.matlet.2004.05.070
Publikováno v:
Thin Solid Films. :459-464
Exposed-die type packaging requires molding process capability to provide mold flash free situation. Presently, the trend is in adopting transfer molding to encapsulate the silicon device with epoxy molding compound, which involves high transfer pres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66157e24cfd6ba2a6bbe980affb55da2
https://doi.org/10.1016/j.tsf.2004.05.115
https://doi.org/10.1016/j.tsf.2004.05.115
Publikováno v:
Microelectronics Reliability. 43:913-923
The key to bonding to copper die is to ensure bond pad cleanliness and minimum oxidation during wire bonding process. This has been achieved by applying a organic coating layer to protect the copper bond pad from oxidation. During the wire bonding pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12332e169cc53aa65d69ad96257971c3
https://doi.org/10.1016/s0026-2714(03)00074-x
https://doi.org/10.1016/s0026-2714(03)00074-x