Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Charles C. Goldsmith"'
Autor:
Yun Zhang, Joe Abys, Ken Takahashi, Christopher Parks, Charles C. Goldsmith, Chen Wang, Charles L. Arvin, George J. Scott
Publikováno v:
ECS Transactions. 35:15-26
Semiconductor packaging technology requires understanding how the fundamental materials properties of different structures interact to impact the final reliability of the system, how to measure those properties and how to control them. We investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06149bd07768436cc28fe4b8a02adb2a
https://doi.org/10.1149/1.3649926
https://doi.org/10.1149/1.3649926
Publikováno v:
Powder Diffraction. 20:112-116
We present a review of the application of diffraction stress/strain analysis to small volumes. For cases in which the material properties and/or the stress state are not homogeneous, traditional approaches may yield erroneous stress results. On the o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e273cbc177c5cb8228a5bf7c70f80a4a
https://doi.org/10.1154/1.1913716
https://doi.org/10.1154/1.1913716
Autor:
Paul A. Lauro, Sung K. Kang, L.P. Lehman, Karl J. Puttlitz, T.M. Korhonen, David E. King, Charles C. Goldsmith, James John Woods, Da-Yuan Shih, Matt A. Korhonen, Jay Bartelo, Donald W. Henderson, Eric J. Cotts, Timothy A. Gosselin
Publikováno v:
Journal of Materials Research. 19:1608-1612
During the solidification of solder joints composed of near-eutectic Sn–Ag–Cu alloys, the Sn phase grows rapidly with a dendritic growth morphology, characterized by copious branching. Notwithstanding the complicated Sn growth topology, the Sn ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb007cb82be0f5d71a9ffe1d03f64500
https://doi.org/10.1557/jmr.2004.0222
https://doi.org/10.1557/jmr.2004.0222
Autor:
Karl J. Puttlitz, Paul A. Lauro, Donald W. Henderson, Timothy A. Gosselin, Da-Yuan Shih, Jay Bartelo, Won Kyoung Choi, Sung K. Kang, Tae K. Hwang, Steve R. Cain, Charles C. Goldsmith
Publikováno v:
MATERIALS TRANSACTIONS. 45:695-702
The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. The electronic industry has begun to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::546053c8613327b41424d196ea8a1cd2
https://doi.org/10.2320/matertrans.45.695
https://doi.org/10.2320/matertrans.45.695
Publikováno v:
Journal of Electronic Materials. 32:1421-1425
Flip-chip carriers have become the preferred solution for high-performance, application-specific integrated circuit and microprocessor devices. Typically, these are packaged in organic or ceramic ball grid array (BGA) packages, which cover a wide ran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4507f85ba9e3af17c615ef9fd7367e2c
https://doi.org/10.1007/s11664-003-0110-6
https://doi.org/10.1007/s11664-003-0110-6
Autor:
Won-Kyoung Choi, Karl J. Puttlitz, Sung K. Kang, Timothy A. Gosselin, Charles C. Goldsmith, Amit K. Sarkhel, Da-Yuan Shih, Donald W. Henderson
Publikováno v:
Journal of Materials Research. 17:2775-2778
Near-ternary eutectic Sn–Ag–Cu alloys are leading candidates for Pb-free solders. These alloys have three solid phases: β–Sn, Ag3Sn, and Cu6Sn5. Starting from the fully liquid state in solidifying near-eutectic Sn–Ag–Cu alloys, the equilib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f5581f616dda32da1b955e00e0d9f77
https://doi.org/10.1557/jmr.2002.0402
https://doi.org/10.1557/jmr.2002.0402
Autor:
Donald W. Henderson, Karl J. Puttlitz, D.-Y. Shih, M.J. Griffin, Myung-Jin Yim, Keith E. Fogel, Sung K. Kang, D.E. King, Amit K. Sarkhel, Timothy A. Gosselin, J.J. Konrad, Gerald G. Advocate, Charles C. Goldsmith, Paul A. Lauro
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 25:155-161
Recently, the research and development activities for replacing Pb-containing solders with Pb-free solders have been intensified due to both competitive market pressures and environmental issues. As a result of these activities, a few promising candi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::148d2754397968d1a677e63d0390699c
https://doi.org/10.1109/tepm.2002.801165
https://doi.org/10.1109/tepm.2002.801165
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::868d47a0a4c532f65b76801d518065b4
https://doi.org/10.1109/ectc.2014.6897567
https://doi.org/10.1109/ectc.2014.6897567
Publikováno v:
Applied Physics Letters. 85:724-726
Conventional formulations of thermal stress evolution in interconnect structures usually ignore the interface integrity between the various levels. In this letter we present thermal and residual stress versus temperature data from simple copper thin-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6dc1d7ef65965f004a759ca8e6636e84
https://doi.org/10.1063/1.1776331
https://doi.org/10.1063/1.1776331
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
A study of NiFe alloy as under bump metallurgy (UBM) for Pb-free interconnect has been performed. Intermetallic growth rate of NiFe and SnAg solder is about 10x slower than that of Ni and SnAg solder. The thin and uniform intermetallic compound FeSn2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bce70b482d6e0752db38c91eb928ff7a
https://doi.org/10.1115/ipack2011-52052
https://doi.org/10.1115/ipack2011-52052