Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Charles C. C. Liu"'
Publikováno v:
DAC
Due to the continuous shrinking of technology nodes, the minimum implant area (MIA) constraint has become a critical issue for modern circuit placement. With a fixed cell height, this constraint can be transferred into a minimum cell width constraint
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d1c9793035ce0d49d3e9672586228eb
https://doi.org/10.1145/2897937.2898045
https://doi.org/10.1145/2897937.2898045
Autor:
Shou-Gwo Wuu, Chin-Hao Chang, Jen-Cheng Liu, Dun-Nien Yaung, Fu-Lung Hsueh, Calvin Yi-Ping Chao, Honyih Tu, Vincent Hsu, Charles C. C. Liu, Szu-Ying Chen
Publikováno v:
VLSIC
A 1.1 um pitch pixel array fabricated by 45 nm 3D stacked technology, can be switched to peripheral circuits on same wafer or to other stacked wafer for process and signal integrity verification. It supports through silicon connection or direct conne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5262dd26d6ae89ea439aac95359e5ba
https://doi.org/10.1109/vlsic.2014.6858370
https://doi.org/10.1109/vlsic.2014.6858370
Autor:
Yu Hu, Wei-Pin Changchien, Sandeep C. Eruvathi, Ruifeng Guo, S. Pan, Liyang Lai, Ting-Pu Tai, Xiaowei Li, Jing Ye, Yu Huang, Charles C. C. Liu, Ji-Jan Chen, Daw-Ming Lee, Kartik K. Kumara, Wu-Tung Cheng
Publikováno v:
ITC
Without appropriate stitching of scan chains, even with good diagnosis algorithm and diagnostic pattern generation, the chain diagnostic resolution may still be bad. In this paper, we propose a novel pattern-independent diagnosis and layout aware (DL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5fa2ef08b254145b5939c9f30c4f8919
https://doi.org/10.1109/test.2013.6651929
https://doi.org/10.1109/test.2013.6651929
Autor:
Chung-Sheng Yuan, Frank Lee, Ching-Fang Chen, Charles C. C. Liu, Ching-Shun Yang, Ji-Jan Chen, Wei-Pin Changchien, Yi-Lin Chuang
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Interposer has emerged as a promising alternative of multiple-die integration to provide high-bandwidth transmission and smaller power consumption. However, few works study the design methodology to utilize interposer advantages and explore the relat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a49bb07d5e8838c4fbca3667849007f0
https://doi.org/10.1109/ectc.2013.6575673
https://doi.org/10.1109/ectc.2013.6575673
Autor:
Charles C. C. Liu
Publikováno v:
Proceedings of the 2013 ACM International symposium on Physical Design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62a3d0f560b5c79bb9ebc5c28464b897
https://doi.org/10.1145/3246456
https://doi.org/10.1145/3246456
Autor:
Charles C. C. Liu
Publikováno v:
Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87d688641b8b96bf5ae5d2f7987715eb
https://doi.org/10.1145/3256423
https://doi.org/10.1145/3256423
Autor:
Nan-Hsin Tseng, James Chien-Mo Li, Wei-Li Hsu, Kuo-Yin Chen, Wei-Pin Changchien, Charles C. C. Liu, Po-Juei Chen
Publikováno v:
Asian Test Symposium
This paper presents a novel diagnosis algorithm for small delay defects (SDD). Faster-than-at-speed test sets are generated by masking long paths in the circuit for testing SDD. The proposed diagnosis technique uses timing upper and lower bound to im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c247b71c67e9f97f4f3fc4be3aa5bfb6
https://doi.org/10.1109/ats.2011.23
https://doi.org/10.1109/ats.2011.23
Autor:
Wen-Jer Tsai, S. Pan, Charles C. C. Liu, N.K. Zous, Chih-Yuan Lu, C.H. Chen, Tahui Wang, Chih Chieh Yeh, S.K. Cho
Publikováno v:
Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de2a2048fd66cce0324f33097060c204
https://doi.org/10.7567/ssdm.2002.a-6-3
https://doi.org/10.7567/ssdm.2002.a-6-3