Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chao-Hsien Peng"'
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
In this work, a low-resistance and low-cost PVD-TiZrN barrier is evaluated for BEOL interconnect. Comparing to conventional PVD barrier, comparable Cu barrier and Cu wetting properties are obtained. Moreover, up to 55% of via resistance reduction is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0922d35660d525c071c4abd5358fe72
https://doi.org/10.1109/iitc-amc.2016.7507722
https://doi.org/10.1109/iitc-amc.2016.7507722
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC); 2016, p174-176, 3p
Autor:
Mong-Song Liang, Chiapyng Lee, Chao-Hsien Peng, Ching-Hua Hsieh, Yu-Lin Kuo, Jing-Cheng Lin, Shau-Lin Shue, Cheng-Lin Huang, Chih-Huang Lai, Li-Chien Chen, Brian J. Daniels
Publikováno v:
Journal of The Electrochemical Society. 151:C176
Titanium zirconium nitride [(Ti,Zr)N] films were prepared on Si substrates by dc reactive magnetron sputtering from a Ti-5 atom % Zr alloy target in N 2 /Ar gas mixtures. Material characteristics of the (Ti,Zr)N films were investigated by X-ray photo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d735f64aa9ac2a1da47fa73399c37f87
https://doi.org/10.1149/1.1644603
https://doi.org/10.1149/1.1644603
Autor:
Jing-Cheng Lin, Chih-Huang Lai, Shau-Lin Shue, Yu-Lin Kuo, Cheng-Lin Huang, Chao-Hsien Peng, Brian J. Daniels, Li-Chien Chen, Ching-Hua Hsieh, Mong-Song Liang, Chiapyng Lee
Publikováno v:
Electrochemical and Solid-State Letters. 6:C123
(Ti,Zr)N films were prepared by dc reactive magnetron sputtering from a Ti-5 atom % Zr alloy target in N 2 /Ar gas mixtures and then employed as diffusion barriers between Cu thin films and Si substrates. Material characteristics of the (Ti,Zr)N film
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d4e0cf62bb7bdfb528e67719b6f2836
https://doi.org/10.1149/1.1592913
https://doi.org/10.1149/1.1592913
Publikováno v:
AIP Conference Proceedings; 2006, Vol. 875 Issue 1, p232-235, 4p, 4 Graphs