Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chao-Chang Arthur Chen"'
Selected, peer reviewed papers from the 4th International Conference on Advanced Manufacturing, March 4-8, 2012, Jiaosi, Taiwan
Autor:
Pei-Jiun Ricky Shiu, Jen-Chieh Li, Hirokuni Hiyama, Lai-You Yang, Yutaka Wada, Chao-Chang Arthur Chen
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:044009
Chemical Mechanical Polishing/Planarization (CMP) is the key process of the wafer and thin film planarization process for semiconductor manufacturing. In the CMP process, the pad can restore its surface topography and efficiency by diamond conditione
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::484a8e27daef3de94ff2dc8284428597
https://doi.org/10.1149/2162-8777/abf47e
https://doi.org/10.1149/2162-8777/abf47e
Autor:
Jen-Chieh Li, Chao-Chang Arthur Chen, Pei-Jiun Ricky Shiu, Lai-You Yang, Hirokuni Hiyama, Yutaka Wada
Publikováno v:
ECS Journal of Solid State Science & Technology; Apr2021, Vol. 10 Issue 4, p124-132, 9p
Publikováno v:
Materials Science Forum. 594:312-323
Contact stylus instrument has difficulties in tracing large slope angle (LSA) lens for surface profile measurement due to the dilation of measured profile image by the shape of stylus tip. This research is to develop a surface profile reconstruction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85f1091e904120a05f23841956104714
https://doi.org/10.4028/www.scientific.net/msf.594.312
https://doi.org/10.4028/www.scientific.net/msf.594.312
Selected, peer reviewed papers from ISAAT 2010