Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Changhae Park"'
Publikováno v:
IEEE Electron Device Letters. 19:237-240
Boron penetration from p/sup +/ doped poly-Si gates in PMOSFET is greatly reduced by post poly-Si gate rapid thermal nitridation. Gate oxide reliability against boron penetration is significantly enhanced. When post poly-Si nitridation is combined wi
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 10:1690-1695
The effects of ion scattering by a silicon dioxide layer on boron distribution profiles implanted through the oxide layer into single‐crystal silicon have been studied. The intensity of ion scattering and the degree of randomization of the directio
Publikováno v:
Journal of The Electrochemical Society. 138:2102-2107
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. :60-64
Ion-implantation-induced damage in crystalline material can cause the shape of implanted impurity distributions to vary strongly with dose. We have developed a model which directly simulates the accumulation of this damage and the effect it has on th
Publikováno v:
Journal of The Electrochemical Society. 138:2107-2115
Autor:
Al F. Tasch, Kevin M. Klein, Steve Novak, Changhae Park, Dennis Kamenitsa, Robert B. Simonton
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. :159-163
The implanted impurity profile variation across a wafer due to an electrostatic scanning system has been studied for boron implants into (100) silicon wafers. The variation of the actual tilt and rotation angles across a wafer has been precisely dete
Autor:
Al F. Tasch, Changhae Park, Dennis Kamenitsa, Kevin M. Klein, Andrew Marlow Ray, Robert B. Simonton
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:39-44
This investigation will present measurements of silicon 〈100〉 wafers, implanted with tilt angles in the range 7–60°, which identify combinations of tilt and azimuthal (twist) angles that avoid major channeling zones. The orientations identifie
Publikováno v:
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering. 10:331-340
A comprehensive and computationally efficient modeling strategy for the rapid and accurate simulation of implanted impurity distribution profiles in single‐crystal silicon has been developed. This modeling strategy exploits the advantages of both M
Publikováno v:
Solid-State Electronics. 33:645-650
A semi-empirical approach for modeling of ion-implanted impurity distributions has an inherent advantage of high computational efficiency which is a vital issue for the simulation of a large number of processing steps required in the fabrication of h
Publikováno v:
1996 Symposium on VLSI Technology. Digest of Technical Papers.
We report for the first time, a bulk silicon, low voltage graded-channel MOSFET (LV-GCMOS) capable of operating below 1 volt, while delivering the required circuit performance. Channel engineering enabled a lowering of the subthreshold slope by more