Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chang-Yueh Chan"'
Autor:
John H. Lau, Scott Chen, Chih-Ming Huang, Jong Ming Ching, Chien-Feng Chan, Chin-Huang Chang, Chi-Hsin Chiu, Carl Chen, V. Kripesh, Chang-Yueh Chan, Aibin Yu, Nandar Su, Aditya Kumar, Khong Chee Houe, Soon Wee Ho, Hnin Wai Yin, Chun-Chieh Chao
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1777-1785
The development of ultrafine-pitch microbumps and the thermal compression bonding (TCB) process for advanced 3-D stacking technology are discussed in this paper. Microbumps, consisting of Cu pillars and thin Sn caps with a pitch of 25 μm, are fabric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6a4fdaa842d54ba73d9eeaa82d838e6
https://doi.org/10.1109/tcpmt.2012.2203130
https://doi.org/10.1109/tcpmt.2012.2203130
Autor:
Chin-Huang Chang, John H. Lau, Scott Chen, Jong Ming Ching, C. Lee, Tan Teck Chun, J. Chiang, Xiaowu Zhang, Nandar Su, Chih-Ming Huang, V. Kripesh, Chang-Yueh Chan, Khong Chee Houe, C.S. Hsiao, Jun Pin Huang, Chi-Hsin Chiu, M. Chew Bi-Rong, Hnin Wai Yin, S. Lim Pei Siang, Aditya Kumar, Aibin Yu, Soon Wee Ho, Daquan Yu
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps with 25 ?m in pitch are fabricated at wafer level by electroplating method and the total thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27d2f39f5b2259de96baaf1b62b15616
https://doi.org/10.1109/eptc.2008.4763465
https://doi.org/10.1109/eptc.2008.4763465
Autor:
Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan
Publikováno v:
2008 10th Electronics Packaging Technology Conference; 2008, p387-392, 6p
Autor:
Wu, Fei-Jain, Ho, Lung-Hua, Kuo, Chih-Ming, Tu, Chia-Jung, Hsieh, Chin-Tang, Ni, Chih-Hsien, Chang, Shih-Chieh, Wu, Chuan-Yu, Huang, Hui-Yu, Lin, Kung-An, Hsu, You-Ming
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1933-1939, 7p
Autor:
Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H., Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Nov2012, Vol. 2 Issue 11, p1777-1785, 9p