Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Chang-Ying Hung"'
Autor:
Chih-Pin Hung, Chi-Han Chen, Pao-Nan Lee, Meng-Jen Wang, Kuan-Chung Lu, Chang-Ying Hung, Tzyy-Sheng Horng, Ho-Ming Tong
Publikováno v:
International Symposium on Microelectronics. 2012:001215-001220
TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC stacking solution in FCBGA (Flip Chip Ball Grid Array). As the 2.5D interposer design pushing toward smaller & shorter via due to high I/O density and high frequency requiremen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a27f63dec7829fe09031e4e8865d0721
https://doi.org/10.4071/isom-2012-thp62
https://doi.org/10.4071/isom-2012-thp62
Publikováno v:
Materials Science Forum. :1599-1604
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::013493c6094c03f39edf195429e01dc3
https://doi.org/10.4028/www.scientific.net/msf.426-432.1599
https://doi.org/10.4028/www.scientific.net/msf.426-432.1599
Autor:
Chang-Ying Hung, Kuan-Chung Lu, Chih-Pin Hung, Chi-Han Chen, Meng-Jen Wang, Pao-Nan Lee, Ho-Ming Tong, Tzyy-Sheng Horng
Publikováno v:
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
In this study, measurements are made to validate the electrical performance of a Through Silicon Via (TSV) interconnection up to 40GHz, and the results of the wideband scalable model of TSV is proposed and compared with the measured data. Measurement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1328e33454fef588e71d7ad5e3bc16bc
https://doi.org/10.1109/edaps.2012.6469406
https://doi.org/10.1109/edaps.2012.6469406
Autor:
Chi-Han Chen, Meng-Jen Wang, Chin-Li Kao, Pao-Nan Lee, Ho-Ming Tong, Chih-Pin Hung, Chang-Ying Hung
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC packaging solution. As the 2.5D interposer design pushing towards smaller & shorter via due to I/O density and electrical performance, the warpage of thinner interposer is ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf163451251e009a946965f6007def48
https://doi.org/10.1109/ectc.2012.6248842
https://doi.org/10.1109/ectc.2012.6248842
Autor:
Chang, Ying-Hung, 張英宏
86
The information superhighway will changes the traditional ways that people live in the twenty-first century. Accompanying the popularity of the World Wide Web, the environment of electronic commerce, which overwhelms marketing and consuming w
The information superhighway will changes the traditional ways that people live in the twenty-first century. Accompanying the popularity of the World Wide Web, the environment of electronic commerce, which overwhelms marketing and consuming w
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/82234597743394629972
