Zobrazeno 1 - 10
of 130
pro vyhledávání: '"Chang-Wook Baek"'
Publikováno v:
IEEE Access, Vol 8, Pp 9513-9519 (2020)
This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 μm thick borosilicate glass substrate, which has very low diel
Externí odkaz:
https://doaj.org/article/a445e8b5aa1343b394230049a7b960f3
Publikováno v:
Micromachines, Vol 14, Iss 2, p 288 (2023)
A millimeter-wave substrate-integrated waveguide (SIW) was firstly demonstrated using the micromachining of photoetchable glass (PEG) for 5G applications. A PEG substrate was used as a dielectric material of the SIW, and its photoetchable properties
Externí odkaz:
https://doaj.org/article/ff464abe33d64df8995c9be6ac90a3e9
Publikováno v:
IEEE Access, Vol 7, Pp 87907-87915 (2019)
In this paper, we demonstrate a V-band planar micromachined helical antenna (PHA) with end-fire radiation on the glass substrate. The planar rectangular helical configuration is realized using the novel through-glass silicon via (TGSV) technology. Th
Externí odkaz:
https://doaj.org/article/0f6171df5cc14f9496248b28c9dd3e0f
Publikováno v:
Micromachines, Vol 13, Iss 8, p 1354 (2022)
In this paper, a MEMS (Micro Electro Mechanical Systems)-based frequency-tunable metamaterial absorber for millimeter-wave application was demonstrated. To achieve the resonant-frequency tunability of the absorber, the unit cell of the proposed metam
Externí odkaz:
https://doaj.org/article/1be633c8bdf240d3ab2252f4aae34cad
Publikováno v:
Sensors, Vol 18, Iss 10, p 3506 (2018)
In this study, we propose a thermal frequency reconfigurable electromagnetic absorber using germanium telluride (GeTe) phase change material. Thermally-induced phase transition of GeTe from an amorphous high-resistive state to a crystalline low-resis
Externí odkaz:
https://doaj.org/article/62e746be82bb43a58d995ad118e24ff4
Autor:
Ik-Jae Hyeon, Chang-Wook Baek
Publikováno v:
Micromachines, Vol 9, Iss 4, p 172 (2018)
A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep reactive ion etching (DRIE) of silicon vias and selective tungsten coating ont
Externí odkaz:
https://doaj.org/article/80833622ccab43bfb6b7795d31116e10
Publikováno v:
IEEE Access, Vol 8, Pp 9513-9519 (2020)
This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 μm thick borosilicate glass substrate, which has very low diel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cc7a078e0263c02b4201395e4374c1d0
https://ieeexplore.ieee.org/document/8951160/
https://ieeexplore.ieee.org/document/8951160/
Publikováno v:
Sensors
Volume 18
Issue 10
Sensors, Vol 18, Iss 10, p 3506 (2018)
Sensors (Basel, Switzerland)
Volume 18
Issue 10
Sensors, Vol 18, Iss 10, p 3506 (2018)
Sensors (Basel, Switzerland)
In this study, we propose a thermal frequency reconfigurable electromagnetic absorber using germanium telluride (GeTe) phase change material. Thermally-induced phase transition of GeTe from an amorphous high-resistive state to a crystalline low-resis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02defe4d3195dc4a57db4e4bf08fb918
Autor:
Chang-Wook Baek, Ik-Jae Hyeon
Publikováno v:
Micromachines; Volume 9; Issue 4; Pages: 172
Micromachines
Micromachines, Vol 9, Iss 4, p 172 (2018)
Micromachines
Micromachines, Vol 9, Iss 4, p 172 (2018)
A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep reactive ion etching (DRIE) of silicon vias and selective tungsten coating ont
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5faf90303aaa26b29a0b328db36800fb
Publikováno v:
Microelectronic Engineering. 136:42-47
Display Omitted THz multi-resonant metamaterial absorber using glass wafer bonding is demonstrated.Pyrex glass wafer is used as a dielectric layer for high absorptivity in THz range.Hexagonal comb-shape resonator is used to realize polarization insen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d21ae86517210a595c340c7718aeebb2
https://doi.org/10.1016/j.mee.2015.04.010
https://doi.org/10.1016/j.mee.2015.04.010