Zobrazeno 1 - 10
of 91
pro vyhledávání: '"Chang-Chi Lee"'
Autor:
Chang-Chi Lee, Hou-Ming Chen, Chi-Chang Lu, Bo-Yi Lee, Hsien-Chi Huang, He-Sheng Fu, Yong-Xin Lin
Publikováno v:
IEEE Access, Vol 8, Pp 62632-62638 (2020)
In this study, a precision bandgap reference with a v-curve correction (VCC) circuit is presented. The proposed VCC circuit generates a correction voltage to reduce the temperature drift of the reference voltage and achieves a low temperature coeffic
Externí odkaz:
https://doaj.org/article/4fd1c922616f4c98a67fbfd71a0dec8d
Autor:
Cadmus C. A. Yuan, Chang-Chi Lee
Publikováno v:
IEEE Access, Vol 8, Pp 143494-143501 (2020)
This article combines the sequential artificial neural network (NN) machine learning with finite element (FE) modeling to assess the solder joint thermal cycling performance. A glass wafer-level chip-scale package (G-WLCSP) is used for this study. Th
Externí odkaz:
https://doaj.org/article/0a0934b6768c42c184157f8d8aff6810
Autor:
Cadmus Yuan, Ming-Lun Chang, Po-An Lin, Chang-Chi Lee, Zhe-Luen Tsui, Wen-Ting Lin, Chic-Chang Wang
Publikováno v:
Electronics
Volume 10
Issue 20
Electronics, Vol 10, Iss 2540, p 2540 (2021)
Volume 10
Issue 20
Electronics, Vol 10, Iss 2540, p 2540 (2021)
Under the pressures of global market uncertainty and rapid production changes, the labor-intensive industries demand instant manufacturing site information and accurate production forecasting. This research applies sensor modules with noise reduction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::98b8ed2d7f5941d4782cd37130cd12c3
Autor:
Chang-Chi Lee, Cadmus Yuan
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper studies AI modeling for the solder joint fatigue risk estimation under the thermal cycle loading of redistributed wafer level packaging. The artificial neural network (ANN), recurrent neural network (RNN) and vectorized-gate network long s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4b0891775ffd3cec0afcfa19e55723c
https://doi.org/10.1109/eurosime48426.2020.9152715
https://doi.org/10.1109/eurosime48426.2020.9152715
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 64:1308-1317
This paper presents a precision bandgap reference with an innovative adjusted-temperature-curvature compensation circuit that obtains a good temperature coefficient (TC) over a wide temperature range. The proposed compensation circuit for enhancing t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49eacefd26df581da6c53e6856702786
https://doi.org/10.1109/tcsi.2017.2658186
https://doi.org/10.1109/tcsi.2017.2658186
Autor:
Fuh-Shyang Juang, Yu-Sung Liu, Jeng-Yue Chen, Hung-Chih Hsu, Chun-Hsiang Tseng, Chang-Chi Lee, Yung-Ying Chang
Publikováno v:
ICCE-TW
This paper uses color identification technology to construct a pesticide residue testing system for fruits and vegetables, which can not only reduce testing costs but also shorten the testing time. The proposed system consists of citing the Acetylcho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f77274ff99e63d26366eae668fa0d394
https://doi.org/10.1109/icce-tw46550.2019.8991943
https://doi.org/10.1109/icce-tw46550.2019.8991943
Autor:
Chen-Yuan Weng, Chang-Chi Lee, Daniel Fisher, Kuo-Chang Kang, Katie Rivera, Bill Guthrie, Che-Ming Hsu, Fan-Yu Min, Ping-Jui Kuo, Luke England
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In order to support emerging applications such as machine learning, where large amounts of fast access memory are required, the use of 3D packaging is inevitable. Previous work on 3D packaging with advanced node logic has shown that the technology is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1cc15266cdcf4dae5513ebe2cf8170ed
https://doi.org/10.1109/ectc.2019.00096
https://doi.org/10.1109/ectc.2019.00096
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Artificial intelligence techniques have been widely applied in many domains, such as image /sound/text recognition, manufacturing monitoring, etc. One of the requirements for an artificial intelligence modeling is massive datasets. However, it is oft
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14524eb4aef5216514768ca5884fe3ea
https://doi.org/10.1109/eurosime.2019.8724570
https://doi.org/10.1109/eurosime.2019.8724570
Publikováno v:
2017 12th IEEE Conference on Industrial Electronics and Applications (ICIEA).
The general brushless DC motor control drives are always equipped with Hall sensor or encoder to provide rotor position feedback. Using those rotor position feedback signals can provide the next driving vector. Based on digital signal controller (DSC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::969f53cf7a409a31eccdc6d106504e6d
https://doi.org/10.1109/iciea.2017.8283102
https://doi.org/10.1109/iciea.2017.8283102
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 600:012018
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aed48b402e0c48405f85430dadccb644
https://doi.org/10.1088/1757-899x/600/1/012018
https://doi.org/10.1088/1757-899x/600/1/012018