Zobrazeno 1 - 1
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pro vyhledávání: '"Chandupatla, Pranavi"'
Autor:
Mathur, Rahul, Chao, Chien-Ju, Liu, Rossana, Tadepalli, Nikhil, Chandupatla, Pranavi, Hung, Shawn, Xu, Xiaoqing, Sinha, Saurabh, Kulkarni, Jaydeep
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m p
Externí odkaz:
http://arxiv.org/abs/2007.16179
