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pro vyhledávání: '"Chandrasekhar Pendyala"'
Autor:
Kousik Ganesan, Thomas Heaton, Suddhastawa Nad, Chandrasekhar Pendyala, Rahul N. Manepalli, Amaneh Tasooji, Radek P. Chalupa, Marcel A. Wall, Yang Sun
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Low cost electroplating of copper to create Fine Line Space (FLS) features and Blind Micro Via's (BMV) is a key technology element of high density substrates for integrated circuit packaging. There is a critical need to provide uniform copper metal d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e45677cf9b747dbcc0b86b95d9ba937
https://doi.org/10.1109/ectc.2017.87
https://doi.org/10.1109/ectc.2017.87
