Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Chandrasekhar Narayan"'
Autor:
Roy D. Cideciyan, Mark A. Lantz, Wayne Isami Imaino, Jens Jelitto, David Berman, Evangelos Eleftheriou, Chandrasekhar Narayan, Thomas Mittelholzer, Robert G. Biskeborn, Gary M. McClelland, Diana J. Hellman, Paul J. Seger, Robert A. Hutchins, Pierre-Olivier Jubert, Kevin B. Judd, Armando Jesus Argumedo, S. Olcer, Walter Häberle, Giovanni Cherubini
Publikováno v:
IBM Journal of Research and Development. 52:513-527
We examine the issue of scaling magnetic tape-recording to higher areal densities, focusing on the challenges of achieving 100 Gb/in2 in the linear tape format. The current highest achieved areal density demonstrations of 6.7 Gb/in2 in the linear tap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::365965758468d22c537061e978ef69d9
https://doi.org/10.1147/rd.524.0513
https://doi.org/10.1147/rd.524.0513
Autor:
Kevin Wilson Warren, Paul Matthew Alt, Steven L. Wright, R. Horton, Chandrasekhar Narayan, Paul F. Greier, M. Kodate
Publikováno v:
IBM Journal of Research and Development. 42:445-458
A new method for repairing line defects during panel fabrication is described for high-resolution thin-film-transistor liquid crystal displays (TFT/LCDs). This approach uses electronic means in conjunction with physical rewiring to supply the appropr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e92e37f4dba8a8f5f04f729570e36f32
https://doi.org/10.1147/rd.423.0445
https://doi.org/10.1147/rd.423.0445
Autor:
Minhua Lu, R. S. Olyha, Chandrasekhar Narayan, Kei-Hsiung Yang, P. M. Alt, J. A. Hoffnagle, J. L. Sanford, Robert Lee Melcher, P. F. Greier
Publikováno v:
IBM Journal of Research and Development. 42:411-426
A prototype reflective spatial light modulator (SLM) system has been developed for writing megabit pages of data into a holographic medium at a rate of 12 pages per minute. The SLM is based upon a crystalline-silicon reflective active-matrix array wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6019165df84ac83850ec98e6d27125b7
https://doi.org/10.1147/rd.423.0411
https://doi.org/10.1147/rd.423.0411
Autor:
Chandrasekhar Narayan, Eugene Stewart Schlig, Kenneth C. Ho, Kunio Enami, Evan G. Colgan, Raminderpal Singh, Fuad E. Doany, Derek B. Dove, J. L. Sanford, Kei-Hsiung Yang, Paul Matthew Alt, Alan E. Rosenbluth, Robert Lee Melcher, Thomas Mario Cipolla, Mitsuru Uda, Robert Stephen Olyha, Istvan Lovas, Carl G. Powell, T. Tomooka
Publikováno v:
IBM Journal of Research and Development. 42:321-338
A prototype 28-in.-diagonal desktop data monitor capable of displaying 2048 × 2048- pixel images has been designed, built, and evaluated. The monitor uses optical projection technology. A reflective, crystalline silicon active-matrix light valve usi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fb36e781562a88a53b171216dbbcd0e
https://doi.org/10.1147/rd.423.0321
https://doi.org/10.1147/rd.423.0321
Autor:
Fuad E. Doany, Chandrasekhar Narayan
Publikováno v:
IBM Journal of Research and Development. 41:151-157
Some applications in microelectronics call for freestanding polyimide films with fine metallic wiring patterns that are thinner than commercially available copper-clad polyimide sheets, which are typically greater than 25 μm in thickness. This work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5efff7033320012faa789f8f13ea5b1
https://doi.org/10.1147/rd.411.0151
https://doi.org/10.1147/rd.411.0151
Akademický článek
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Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures
Autor:
W. Graham, Eileen A. Galligan, Sharon L. Nunes, C.-A. Chang, D.-Y. Shih, Janusz S. Wilczynski, John J. Ritsko, J. Lewis, Chandrasekhar Narayan, Laura Beth Rothman, J. Cataldo, Richard P Mcgouey, Helen Li Yeh, Alina Deutsch, Jurij R. Paraszczak, Eric D. Perfecto, Russell J. Serino
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:74-88
The use of a lift-off technique to fabricate a high-density structure consisting of multiple layers of metal/polyimide thin-film structures on a silicon substrate is described. To achieve better performance and high yield, the process design, the pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4213d47f46df77f54b2eb6af3c4b576
https://doi.org/10.1109/33.214864
https://doi.org/10.1109/33.214864
Publikováno v:
Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings
On peut classer les interfaces ceramique/metal en quatre groupes : presence d'oxydes metalliques purs a l'interface; presence d'oxydes ternaires ou plus complexes a l'interface; formation de solution solide dans la ceramique pres de l'interface; form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::818769c3bb944d501fd6a33cb6dbf66e
https://doi.org/10.1002/9780470312568.ch15
https://doi.org/10.1002/9780470312568.ch15
Akademický článek
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Publikováno v:
Proceedings of the International Conference on Multichip Modules.
This paper describes a unique, highly flexible cost competitive method to fabricate microelectronic packages that require thin film interconnections. The method involves fabricating thin film metal/polymer structures multi-up on a reusable temporary
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f9d32a1276277de1109911e365c76b8
https://doi.org/10.1109/icmcm.1994.753537
https://doi.org/10.1109/icmcm.1994.753537