Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Chandra S Tiwari"'
Autor:
Yong Sheng Lim, Chandra S Tiwari, Patrick Flynn, Lai Ho Mak, Matt Gisinger, Jay Srinivasan, Ralph Fulton
Publikováno v:
ECS Transactions. 58:251-259
The descum process is temperature-sensitive process. It has been demonstrated that the process is very sensitive to silicon substrate doping, which impacts wafer heating. A higher doping level caused much higher resist removal when the descum process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb9ba42c07fe4feb7b581d369a75221d
https://doi.org/10.1149/05806.0251ecst
https://doi.org/10.1149/05806.0251ecst
Autor:
Chandra S Tiwari, Yong Sheng Lim, Ralph Fulton, Jay Srinivasan, Matt Gisinger, Patrick Flynn, Lai Ho Mak
Publikováno v:
ECS Meeting Abstracts. :2123-2123
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b215a245625958bc620fb7ab90671f
https://doi.org/10.1149/ma2013-02/30/2123
https://doi.org/10.1149/ma2013-02/30/2123
Autor:
Chandra S. Tiwari, Tony Guo, Chris Breyfogle, John Zhang, Henis Mitro, Len Olmer, Vivek Kumar, Doug Pohlman, Megan Rutte
Publikováno v:
ECS Meeting Abstracts. :2440-2440
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbc55de01a538de9c28f9b9ba90d6720
https://doi.org/10.1149/ma2012-02/27/2440
https://doi.org/10.1149/ma2012-02/27/2440
Autor:
Chandra S. Tiwari
Publikováno v:
ECS Meeting Abstracts. :1967-1967
The applications in micro-chips include damascene Cu metallization [1], CoWP capping layer for Cu [2], Ni/Au [3], or Ni/Pd metal deposition on a bond pad. This article discusses electroless (EL) Ni deposition for high aspect ratio sub-micron vias. Ty
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38c6fc4603784317250645969e0bc53f
https://doi.org/10.1149/ma2010-02/31/1967
https://doi.org/10.1149/ma2010-02/31/1967