Zobrazeno 1 - 8
of 8
pro vyhledávání: '"ChanHa Hwang"'
Publikováno v:
Model Assisted Statistics and Applications. 15:239-248
Spatial panel data model captures spatial interactions across spatial units and over time. Lots of effort have been devoted to develop effective estimation methods for parametric and nonparametric spatial panel data models. Varying coefficient model
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d423f9092ad6d564c641c0fcf3d76a0
https://doi.org/10.3233/mas-200491
https://doi.org/10.3233/mas-200491
Autor:
MinJae Lee, Sungsoon Park, Myung-June (M J) Lee, Youshin Jung, Choonheung Lee, DongSu Ryu, Yanggyoo Jung, ChanHa Hwang, Sunwoo Park, Miguel Jimarez
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Recently, technologies related to Fine Pitch Flip Chip or FPFC have been great achievements for various next generation devices, allowing a significant increase in the number of signal I/O and achieving low form factor packages. Consequently, fine pi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::708308f1ba5960d3ca68b7fdd6a8adbb
https://doi.org/10.1109/ectc.2012.6248868
https://doi.org/10.1109/ectc.2012.6248868
Autor:
SeungJae Lee, BooYang Jung, Kicheol Bae, Choonheung Lee, Jiheon Yu, YoungSuk Chung, SangWon Kim, Brett Arnold Dunlap, Nozad Karim, Jin Young Kim, ChanHa Hwang
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
In this paper, development of wafer level fan-out (WLFO) technology using ajinomoto build-up film (ABF) substrate with laser ablation process is introduced for low cost and high electrical performance for millimeter wave application. Wafer level fan-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90bfe023c7c07ef8920e8f75b61c5bf4
https://doi.org/10.1109/ectc.2010.5490804
https://doi.org/10.1109/ectc.2010.5490804
Publikováno v:
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
This paper discuss electrical characterization of new developed hybrid package, FusionQuad, that is converging QFN and TQFP type package to have good electrical performance with high I/O pin counts. Precise electrical modelling from wire-to-motherboa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49dd44de0bd94e8d7732cbc71786ec2e
https://doi.org/10.1109/edaps.2009.5404000
https://doi.org/10.1109/edaps.2009.5404000
Autor:
Do Hyung Kim, KyeongSool Seong, ChoonHeong Lee, BongChan Kim, Yoon-joo Kim, JaeKyu Song, ChanHa Hwang
Publikováno v:
2009 59th Electronic Components and Technology Conference.
In the semiconductor market, the trend of packaging for die stacking technology moves to high density with thinner chips and higher capacity of memory devices. Moreover, the wafer sawing process is becoming more important for thin wafer, because its
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5be8acfcc3beafb9301eba75cd731ef
https://doi.org/10.1109/ectc.2009.5074216
https://doi.org/10.1109/ectc.2009.5074216
Publikováno v:
2009 59th Electronic Components and Technology Conference.
The current standard for flipchip encapsulantion is a two step process. Following flipchip attach, a liquid underfill material is dispensed along the die edge and allowed to flow, via adhesive capillary force, through the gap between the flipchip die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cafaf1ce0821d5f98e07eeea467c692b
https://doi.org/10.1109/ectc.2009.5074128
https://doi.org/10.1109/ectc.2009.5074128
Autor:
DoHyung Kim, YoonJoo Kim, KyeongSool Seong, JaeKyu Song, BongChan Kim, ChanHa Hwang, ChoonHeong Lee
Publikováno v:
2009 59th Electronic Components & Technology Conference; 2009, p1531-1536, 6p
Publikováno v:
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS); 2009, p1-4, 4p