Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chan Wai Kok"'
Publikováno v:
In Journal of Information Security and Applications May 2021 58
Publikováno v:
In CIRP Annals - Manufacturing Technology 2013 62(1):75-78
Autor:
Chan Wai Kok1 wkchan@mmu.edu.my, Beg, M. Salim2
Publikováno v:
International Journal of Communication Systems. Feb2002, Vol. 15 Issue 1, p67-83. 17p. 6 Diagrams, 3 Charts.
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Bare copper (Cu) wire is one of the promising materials used in assembly packaging to replace gold wire. As copper is harder compared to gold, the formation of the looping during wire bonding is a concern and challenge especially to ball neck surface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b275abe58631c1d5176f08e8d97e8bff
https://doi.org/10.1109/eptc.2012.6507134
https://doi.org/10.1109/eptc.2012.6507134
Autor:
Chan Wai Kok, M.S. Beg
Publikováno v:
ICON
This paper describes a simple method of implementing an IP subnet VLAN. Normally, switches have to exchange VLAN membership information with its neighboring switches via some form of VLAN registration protocol. This is to ensure proper operation of V
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74fa79226a0399be78132ed62209a9fc
https://doi.org/10.1109/icon.2001.962334
https://doi.org/10.1109/icon.2001.962334
Publikováno v:
LCN
VLAN learning may be performed via inspection of the received frame. Some bridges will not be able to perform VLAN learning via frame inspection due to MAC bridging, VLAN filtering and IP routing process. End-stations attached to these bridges will n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff61efa443b59abb7cab523afd2fbe73
https://doi.org/10.1109/lcn.2000.891093
https://doi.org/10.1109/lcn.2000.891093
Autor:
Chan Wai Kok, Beg, M.S.
Publikováno v:
Proceedings Ninth IEEE International Conference on Networks, ICON 2001; 2001, p160-165, 6p
Publikováno v:
Proceedings 25th Annual IEEE Conference on Local Computer Networks. LCN 2000; 2000, p520-521, 2p
Conference
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