Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Chan Kheng Jin"'
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The numbers of electronic devices are increasing year on year basis in our cars. New additions such as Autonomous Self Driving, ADAS and e-mobility: electrification of cars will include charging and thereby extend further in future our expected requi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc521268aad5fcd20d33eeba39c21e80
https://doi.org/10.1109/eptc.2018.8654301
https://doi.org/10.1109/eptc.2018.8654301
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
This paper presents the development of evaluating the Palladium-coated Copper (Pd-Cu) and Bare Cu wire bonding material, along with two different type of ‘Low-k’ and conventional capillaries on two different Aluminium (Al) thickness underneath a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e2a0f5feb148bc2c9aaff2308ab1372
https://doi.org/10.1109/eptc.2012.6507132
https://doi.org/10.1109/eptc.2012.6507132
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
This paper presents the challenges of time zero bond integrity for Palladium-coated Copper (Pd-Cu) wire bonding on C65 Aluminium (Al) bond pad low dielectric constant (low-k) wafer with Bond Over Active (BOA) pad structure. The LQFP-176 7.9mm×8.5mm,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b87623c41822017398f85c4f75b8cef
https://doi.org/10.1109/eptc.2011.6184452
https://doi.org/10.1109/eptc.2011.6184452
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p391-396, 6p