Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Chan Kai Chong"'
Autor:
Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun
Publikováno v:
In Microelectronics Reliability 2010 50(7):986-994
Autor:
Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong
Publikováno v:
In Microelectronics Reliability 2009 49(2):150-162
Autor:
John D. Beleran, Nathapong Suthiwongsunthorn, Ninoy Milanes, Chan Kai Chong, Ranjan Rajoo, Gaurav Mehta
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The use of copper wire in IC packaging has been growing steadily driven by cost effectiveness. However, there are concerns and issues that prevent or delay copper wire bonding technology qualification. Copper wire inherent hardness properties induces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41516385e38dcd1e5fcb6d85042f9a63
https://doi.org/10.1109/ectc.2014.6897329
https://doi.org/10.1109/ectc.2014.6897329
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this paper, the fundamental understanding of copper (Cu) wire bonding process, and its interaction with the die bond pad surface and structure will be examined, using both Finite Element Analysis (FEA) and experimental study. In the FEA, the Cu wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcf05c112f405bbcce0b0e033274fc0f
https://doi.org/10.1109/ectc.2012.6248976
https://doi.org/10.1109/ectc.2012.6248976
Autor:
Chan, Kai Chong.
Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1392::eaf8caca764900d8a9c80e37a5f9478f
http://hdl.handle.net/10356/13437
http://hdl.handle.net/10356/13437
Akademický článek
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Autor:
Zheng, Boyu, Cubillo, Joseph Romen, Katti, Guruprasad, Jin, Cheng, Rajoo, Ranjan, Chan, Kai Chong
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p401-406, 6p
Conference
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