Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Chan, Wai Yew Brian"'
Evaluation of structural epoxy and cyanoacrylate adhesives on jointed 3D printed polymeric materials
Autor:
Yap, Yee Ling, Toh, William, Koneru, Rahul, Lin, Rongming, Chan, Keen Ian, Guang, Huanyu, Chan, Wai Yew Brian, Teong, Soo Soon, Zheng, Guoying, Ng, Teng Yong
Publikováno v:
In International Journal of Adhesion and Adhesives July 2020 100
Autor:
Yap, Yee Ling, Toh, William, Koneru, Rahul, Lin, Kehua, Yeoh, Kirk Ming, Lim, Chin Mian, Lee, Jia Shing, Plemping, Nur Adilah, Lin, Rongming, Ng, Teng Yong, Chan, Keen Ian, Guang, Huanyu, Chan, Wai Yew Brian, Teong, Soo Soon, Zheng, Guoying
Publikováno v:
In Mechanics of Materials May 2019 132:121-133
Autor:
Yap, Yee Ling, Toh, William, Koneru, Rahul, Chua, Zhong Yang, Lin, Kehua, Yeoh, Kirk Ming, Lim, Chin Mian, Lee, Jia Shing, Plemping, Nur Adilah, Lin, Rongming, Ng, Teng Yong, Chan, Keen Ian, Guang, Huanyu, Chan, Wai Yew Brian, Teong, Soo Soon, Zheng, Guoying
Publikováno v:
International Journal of Computational Materials Science & Engineering; Mar2019, Vol. 8 Issue 1, pN.PAG-N.PAG, 14p