Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chan, Wai Kok"'
Publikováno v:
In Journal of Information Security and Applications May 2021 58
Publikováno v:
In CIRP Annals - Manufacturing Technology 2013 62(1):75-78
Autor:
Chan Wai Kok1 wkchan@mmu.edu.my, Beg, M. Salim2
Publikováno v:
International Journal of Communication Systems. Feb2002, Vol. 15 Issue 1, p67-83. 17p. 6 Diagrams, 3 Charts.
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Bare copper (Cu) wire is one of the promising materials used in assembly packaging to replace gold wire. As copper is harder compared to gold, the formation of the looping during wire bonding is a concern and challenge especially to ball neck surface
Autor:
Chan Wai Kok, M.S. Beg
Publikováno v:
ICON
This paper describes a simple method of implementing an IP subnet VLAN. Normally, switches have to exchange VLAN membership information with its neighboring switches via some form of VLAN registration protocol. This is to ensure proper operation of V
Publikováno v:
LCN
VLAN learning may be performed via inspection of the received frame. Some bridges will not be able to perform VLAN learning via frame inspection due to MAC bridging, VLAN filtering and IP routing process. End-stations attached to these bridges will n
Autor:
Chan Wai Kok, Beg, M.S.
Publikováno v:
Proceedings Ninth IEEE International Conference on Networks, ICON 2001; 2001, p160-165, 6p
Publikováno v:
Proceedings 25th Annual IEEE Conference on Local Computer Networks. LCN 2000; 2000, p520-521, 2p
Conference
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