Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chai Chee Meng"'
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
Wire bond interconnection still remains to be one of the most important fields of study in IC packaging development. The robustness of the interconnection between the bond wire and the bond pad are highly dependent on several key factors, mainly: 1)
Autor:
Eric Yong Woon Yik, Chai Chee Meng
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
In wire bond process, wire bond recipe is predefined to wire bonder before the start of wire bonding. This wire bond recipe comprises of single step to multi steps bond force and ultrasonic control depending on type of wire material and bond pad tech
Akademický článek
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Publikováno v:
2011 International Symposium on Advanced Packaging Materials (APM).
This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials' thermo-mechanical properties at different high temperature storage conditions. Package level reli
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
In this work, a new empirical method is proposed to incorporate the initial substrate warpage into package stress simulation. As a first step, the bare substrate strip warpage characteristics were mapped. The out-of-plane displacements of the substra
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Exposed pad packages were first introduced for their superior electrical and thermal performance. Some of the exposed pad packages do include a separate ground ring structure that is situated between the die pad and inner end of the leads. The ground
Publikováno v:
International Symposium on Advanced Packaging Materials (APM), 2011; 2011, p403-409, 7p
Publikováno v:
2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p637-640, 4p
Publikováno v:
2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p500-504, 5p