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pro vyhledávání: '"Chai, Tai Chong"'
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Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::990118256eac1cc35c04ef362d020300
https://doi.org/10.1109/eptc56328.2022.10013241
https://doi.org/10.1109/eptc56328.2022.10013241
Autor:
Soon Wee Ho, Hsiao Hsiang-Yao, Lau Boon Long, Sharon Lim Pei Siang, Lim Teck Guan, Chai Tai Chong
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2af2f31079e9b42f5e7c5d03163b9bb4
https://doi.org/10.1109/ectc51906.2022.00221
https://doi.org/10.1109/ectc51906.2022.00221
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03219e1d4f7e34b4319d8cbd85bfb662
https://doi.org/10.1109/ectc51906.2022.00110
https://doi.org/10.1109/ectc51906.2022.00110
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7016d44510a8ce1dba928c6e5ac41618
https://doi.org/10.1109/ectc51906.2022.00022
https://doi.org/10.1109/ectc51906.2022.00022
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac1b73f080394ec9a1e5676e9d8e55e
https://doi.org/10.1109/eptc53413.2021.9663939
https://doi.org/10.1109/eptc53413.2021.9663939
Autor:
Rathin Mandal, Chai Tai Chong
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3574b2d8936378a7f489b0e5238b06cf
https://doi.org/10.1109/eptc53413.2021.9663967
https://doi.org/10.1109/eptc53413.2021.9663967
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::841fccb204d0c517cd0c33bbffd551b6
https://doi.org/10.1109/eptc53413.2021.9663962
https://doi.org/10.1109/eptc53413.2021.9663962
Autor:
Sharon Lim Pei Siang, Chong Ser Choong, Lim Teck Guan, Han Yong, Surya Bhattacharya, David Ho, Chai Tai Chong
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
High density heterogeneous integration of ASIC and HBM2 through the use of embedded fine pitch interconnect (EFI) in face-to-face configuration using RDL 1st fan-out wafer packaging platform is demonstrated. The EFI configuration, thermal design cons
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b752aaad551fa44e8aba4bbc32f99ef5
https://doi.org/10.1109/ectc32696.2021.00348
https://doi.org/10.1109/ectc32696.2021.00348
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Fan-Out Wafer-Level-Packaging (FOWLP) that directly molds the bare die inside the package with the antenna fabricating on the package stands out a very elegant and compact solution for 77GHz MIMO radar. This paper presents the Long Range Radar (LRR)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f86124a665ef8a5de1a6d4252b60ea5
https://doi.org/10.1109/ectc32696.2021.00189
https://doi.org/10.1109/ectc32696.2021.00189