Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Chae Hyuck Ahn"'
Autor:
Janna Rodriguez, Dongsuk D. Shin, Yunhan Chen, Ian B. Flader, Thomas W. Kenny, Chae Hyuck Ahn
Publikováno v:
Journal of Microelectromechanical Systems. 26:1235-1243
This paper presents a novel wafer-level thin-film encapsulation process that allows both narrow and wide trenches, which are necessary for traditional structures such as comb-drives. Fully functional devices with trench widths up to 50 $\mu \text{m}$
Autor:
Christopher A. Watson, Janna Rodriguez, Grant M. Glaze, Yushi Yang, Eldwin J. Ng, Saurabh A. Chandorkar, Thomas W. Kenny, Chae Hyuck Ahn
Publikováno v:
Scientific Reports
Scientific Reports, Vol 9, Iss 1, Pp 1-10 (2019)
Scientific Reports, Vol 9, Iss 1, Pp 1-10 (2019)
Silicon Microelectromechanical Systems (MEMS) resonators have broad commercial applications for timing and inertial sensing. However, the performance of MEMS resonators is constrained by dissipation mechanisms, some of which are easily detected and w
Publikováno v:
Journal of Microelectromechanical Systems. 25:469-478
A systematic experimental and theoretical evaluation of stiction between intermittently contacting silicon surfaces in an ultra-clean encapsulation process is presented, evaluating magnitude of stiction forces, the reversible nature of sidewall conta
Publikováno v:
Journal of Microelectromechanical Systems. 24:1687-1694
In this paper, we present the fabrication and test results of an oxide-coated polysilicon disk resonator gyroscope in a wafer-scale encapsulation process. We demonstrate the effects of an oxide coating on the device structure and the key performance
Autor:
Yushi Yang, Chengkuo Lee, Thomas W. Kenny, Chae Hyuck Ahn, Eldwin J. Ng, You Qian, Bo Woon Soon, Vu A. Hong
Publikováno v:
Journal of Microelectromechanical Systems. 24:1906-1915
We report on characterization of Si-to-Si contact microswitches fabricated in an ultraclean encapsulation process. This three-terminal microswitch relies on a curved beam (source) that actuates toward the contact terminal (drain) by charging the cont
Autor:
Javier Rodríguez, Rob N. Candler, J. Lake, Chae Hyuck Ahn, Grant M. Glaze, Thomas W. Kenny, L. Comenencia Ortiz, Yushi Yang, Gabrielle D. Vukasin
Publikováno v:
2018 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Autor:
Grant M. Glaze, Lizmarie Comenencia Ortiz, Matthew A. Hopcroft, Eldwin J. Ng, Thomas W. Kenny, Woosung Park, Christopher A. Watson, Gabrielle D. Vukasin, Janna Rodriguez, Chae Hyuck Ahn
Publikováno v:
2018 IEEE International Frequency Control Symposium (IFCS).
The aim of this study is to investigate the behavior of the thermal expansion coefficient (CTE) of silicon at different crystallographic orientations through studies of the quality factor, Q, over a wide range of temperatures. We investigate how the
Autor:
Janna Rodriguez, Anne L. Alter, Dongsuk D. Shin, Ian B. Flader, Chae Hyuck Ahn, Yunhan Chen, Thomas W. Kenny
Publikováno v:
2018 IEEE Micro Electro Mechanical Systems (MEMS).
This work demonstrates, for the first time, a wafer-scale encapsulation process for hermetic sealing of MEMS resonant structures incorporating fully differential electrodes, in and out of the device plane, and large lateral transduction gaps. The pol
Autor:
Yushi Yang, Beth L. Pruitt, Thomas W. Kenny, Matthew A. Hopcroft, Vu A. Hong, Eldwin J. Ng, C. L. Roozeboom, Chae Hyuck Ahn, Bridget E. Hill
Publikováno v:
Journal of Microelectromechanical Systems. 24:810-821
We present multifunctional integrated sensors (MFISES) that combine temperature, humidity, pressure, air speed, chemical gas, magnetic, and acceleration sensing on a single 2-mm $\times 2$ -mm die. We fabricate the MFISES in a wafer scale encapsulati
Autor:
Thomas W. Kenny, Camille L. M. Everhart, Eldwin J. Ng, Yushi Yang, Chae Hyuck Ahn, Vu A. Hong
Publikováno v:
Journal of Microelectromechanical Systems. 24:730-741
Resonators fabricated in heavily doped silicon have been noted to have a reduced frequency-temperature dependence compared with lightly doped silicon. The resonant frequency of silicon microelectromechanical systems (MEMS) resonators is largely gover