Výsledky vyhledávání - "Cha Gyu Song"

Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copper Pillar Bump

Autor: Cha Gyu Song, Hoon Sun Jung, Oh Young Kwon, Sung-Hoon Choa, Eun-Sook Sohn

Publikováno v: Nanoscience and Nanotechnology Letters. 9:1139-1145

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bcc9c8e4b02f98e872cef83c7d6e765a
https://doi.org/10.1166/nnl.2017.2473

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Parametric Study of Low-k Layer Stress for a Flip-Chip Chip Size Package Using a Copper Pillar Bump

Autor: Jin Young Kim, Choonheung Lee, Cha Gyu Song, Sung-Hoon Choa, Eun-Sook Sohn, Hoon Sun Jung, Juhoon Yoon, DaeByoung Kang

Publikováno v: Nanoscience and Nanotechnology Letters. 8:1-7

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e7f951019472b2cebb303bdbfc6a4e66
https://doi.org/10.1166/nnl.2016.2095

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Investigation of durability of TSV interconnect by numerical thermal fatigue analysis

Autor: Cha Gyu Song, Sung-Hoon Choa, Haeng Soo Lee

Publikováno v: International Journal of Precision Engineering and Manufacturing. 12:589-596

3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. However, increased number of interconnects and extreme miniaturization suggest that thermo-mechanical reliability and fatigue will aggravate. In t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::107d961b2dd6cd2ca27d23b592b2b485
https://doi.org/10.1007/s12541-011-0076-x

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Thermo-mechanical Reliability Analysis of Copper TSV

Autor: Sung-Hoon Choa, Cha-Gyu Song

Publikováno v: Journal of the Korean Welding and Joining Society. 29:46-51

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the dri

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b1dcf3d935350b3afa6967b613e909f7
https://doi.org/10.5781/kwjs.2011.29.1.046

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Warpage Study of Ultra Thin Package Used in Mobile Devices

Autor: Kyoung-Ho Kim, Cha-Gyu Song, Sung-Hoon Choa

Publikováno v: Journal of the Korean Welding and Joining Society. 29:20-24

특히 패키지의 두께가 얇아지게 되면 패키지의 휨 현상은 패키지의 신뢰성뿐만 아니라 공정상의 여러 가지 문제를 발생시킬 수 있다. 패키지의 휨 현상은 일반적으로 패키지의 EMC 몰딩 과�

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::21b4246a2db3a2b87d68d182b91cb847
https://doi.org/10.5781/kwjs.2011.29.1.020

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Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip Package

Autor: Cha Gyu Song, Haeng Soo Lee, Sung-Hoon Choa, Jin Young Choi

Publikováno v: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:001697-001725

Through silicon via (TSV) technology is becoming a hot topic for three dimensional integration in IC packaging industry. However, TSV technology raises several reliability concerns particularly caused by thermally induced stress. In this study, the t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9169ef3f49206317fa803fbf471d2858
https://doi.org/10.4071/2010dpc-wp13

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