Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Ceuninck, W. De"'
Autor:
Eersels, K., van Grinsven, B., Vandenryt, T., Jiménez‐Monroy, K. L., Peeters, M., Somers, V., Püttmann, C., Stein, C., Barth, S., Bos, G. M. J., Germeraad, W. T. V., Diliën, H., Cleij, T. J., Thoelen, R., Ceuninck, W. De, Wagner, P.
Publikováno v:
Physica Status Solidi. A: Applications & Materials Science; Jun2015, Vol. 212 Issue 6, p1320-1326, 7p
Autor:
Murib, M. S., van Grinsven, B., Grieten, L., Janssens, S. D., Vermeeren, V., Eersels, K., Broeders, J., Ameloot, M., Michiels, L., Ceuninck, W. De, Haenen, K., Schöning, M. J., Wagner, P.
Publikováno v:
Physica Status Solidi. A: Applications & Materials Science; May2013, Vol. 210 Issue 5, p911-917, 7p
Autor:
Murib, M. S., van Grinsven, B., Grieten, L., Janssens, S. D., Vermeeren, V., Eersels, K., Broeders, J., Ameloot, M., Michiels, L., Ceuninck, W. De, Haenen, K., Schöning, M. J., Wagner, P.
Publikováno v:
Physica Status Solidi (A) - Applications and Materials Science; May 2013, Vol. 210 Issue: 5 p911-917, 7p
Autor:
Schepper, L. De, Ceuninck, W. De, Lekens, G., Stals, L., Vanhecke, B., Roggen, J., Beyne, E., Tielemans, L.
Publikováno v:
Quality & Reliability Engineering International; Jan/Feb94, Vol. 10 Issue 1, p15-26, 12p
Autor:
Munters, T., Martens, T., Goris, L., Vrindts, V., Manca, J., Lutsen, L., Ceuninck, W. De, Vanderzande, D., Schepper, L. De, Gelan, J.
Publikováno v:
Thin Solid Films; 2002, Vol. 403 Issue: 1 p247-251, 5p
Autor:
Croes, K., Dreesen, R., Manca, J., Ceuninck, W. De, Schepper, L. De, Tielemans, L., Wel, P. van Der
Publikováno v:
Microelectronics Reliability; 2001, Vol. 41 p1439-1442, 4p
Publikováno v:
Microelectronics Reliability; 2001, Vol. 41 p1591-1596, 6p
Autor:
Dreesen, R., Croes, K., Manca, J., Ceuninck, W. De, Schepper, L. De, Pergoot, A., Groeseneken, G.
Publikováno v:
Microelectronics Reliability; 2001, Vol. 41 Issue: 3 p437-443, 7p
Autor:
Dreesen, R., Croes, K., Manca, J., Ceuninck, W. De, Schepper, L. De, Pergoot, A., Groeseneken, G.
Publikováno v:
Microelectronics Reliability; 1999, Vol. 39 Issue: 6 p785-790, 6p
Publikováno v:
Microelectronics Reliability; 1999, Vol. 39 Issue: 2 p269-273, 5p