Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Celso Cavaco"'
Autor:
Yun-Tzu Chang, Pol Van Dorpe, Celso Cavaco, Andrea Vinci, Mitali Sinha, Pierre Boulenc, Andreas Suss, Tom Verschooten, Chris Van Hoof, Jiwon Lee
Publikováno v:
IEEE Sensors Journal. 22:18428-18436
Autor:
Koen De Munck, Edward Van Sieleghem, Andreas Süss, Gauri Karve, Jiwon Lee, Celso Cavaco, Chris Van Hoof, Pierre Boulenc
Publikováno v:
IEEE Electron Device Letters. 42:879-882
A near-infrared (NIR) enhanced silicon single-photon avalanche diode (SPAD) fabricated in a customized 0.13 $\mu$m CMOS technology is presented. The SPAD has a depleted absorption volume of approximately 15 $\mu$m x 15 $\mu$m x 18 $\mu$m. Electrons g
Autor:
Edward Van Sieleghem, Gauri Karve, Koen De Munck, Andrea Vinci, Celso Cavaco, Andreas Suss, Chris Van Hoof, Jiwon Lee
A backside-illuminated (BSI) near-infrared enhanced silicon single-photon avalanche diode (SPAD) for time-of-flight (ToF) light detection and ranging applications is presented. The detector contains a 2 $\mu$m wide multiplication region with a spheri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b76733c536ac95b5f63244060f5f1e0
http://arxiv.org/abs/2203.01560
http://arxiv.org/abs/2203.01560
Autor:
Gemma Taverni, Celso Cavaco, Vasyl Motsnyi, Diederik Paul Moeys, Tobi Delbruck, David San Segundo Bello, Chenghan Li
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 65:677-681
Back side illumination has become standard image sensor technology owing to its superior quantum efficiency and fill factor. A direct comparison of front and back side illumination (FSI and BSI) used in event-based dynamic and active pixel vision sen
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
In this paper is reported for the first-time wafer level electrical data on 200 mm wafer to wafer hybrid copper to dielectric bonding at low temperature, using SiN as the dielectric material. In this work was used up to five metal levels per wafer. S
Autor:
Celso Cavaco, David San Segundo Bello, Gemma Taverni, Chenghan Li, Diederik Paul Moeys, Tobi Delbruck, Vasyl Motsnyi
Publikováno v:
ISCAS
The demonstration shows the differences between two novel Dynamic and Active Pixel Vision Sensors (DAVIS). While both sensors are based on the same circuits and have the same resolution (346×260), they differ in their manufacturing. The first sensor
Autor:
Paul Heremans, Stefano Guerrieri, Andreas Süss, Luis Moreno Hagclsieb, Griet Uytterhoeven, Jorick Maes, Epimitheas Gcorgitzikis, Pawel E. Malinowski, Konstantinos Chatzinis, David Cheyns, Vladimir Pejovic, Celso Cavaco, Zeger Hens
© 2018 IEEE. The integration of infrared sensitive thin-film materials with solution processing capabilities on top of Si substrates is a significant step towards cost-efficient infrared imagers. Colloidal quantum dots based on lead sulfide are very
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10b80d1fef87700892774a3a27381249
https://lirias.kuleuven.be/handle/20.500.12942/699268
https://lirias.kuleuven.be/handle/20.500.12942/699268
Autor:
Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz Sabuncuoglu Tezcan, Haris Osman, Celso Cavaco
Publikováno v:
International Symposium on Microelectronics. 2015:000594-000597
We show for the first time complete data on 200mm wafer to wafer copper oxide direct bonding of two metal levels. Both surface acoustic microscope (SAM) and cross-section scanning electron microscope (X-SEM) images taken across the bonded wafer pairs
Autor:
Farid Sebaai, Greet Verbinnen, Deniz Sabuncuoglu Tezcan, Jakob Visker, Lan Peng, Celso Cavaco, Haris Osman, Jan Van Olmen
Publikováno v:
ECS Transactions. 64:123-129
Top candidate to further improve the performance of CMOS image sensors while keeping up with the market demands for thinner, lighter, and more sophisticated applications such as smartphones and tablets, is backside illuminated (BSI) image sensors. In
Autor:
Fabian F. Voigt, Celso Cavaco, Pia Sipila, Diederik Paul Moeys, Fritjof Helmchen, David San Segundo Bello, Stewart Berry, Tobi Delbruck, Vasyl Motsnyi, Chenghan Li, Gemma Taverni
Publikováno v:
BioCAS
The demonstration shows the comparison of two novel Dynamic and Active Pixel Vision Sensors (DAVIS) in the context of a simulated neural imaging experiment. The first sensor, the SDAVIS, has, although a lower resolution (188×192) with respect to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::04d00274fd8cb97e41590ed4fca83bd9
https://www.zora.uzh.ch/id/eprint/168622/
https://www.zora.uzh.ch/id/eprint/168622/