Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Cathy Gow"'
Autor:
Brian Yueh-Ling Hsieh, Derek McKindles, Oliver D. Patterson, Xiaohu Tang, Cathy Gow, Richard F. Hafer
Publikováno v:
International Symposium for Testing and Failure Analysis.
For a recent replacement metal gate (RMG) technology using a SOI substrate, residue from the dummy gate formed a defect that affected the RMG formation. In this FINFET technology, the high aspect ratio of the gate makes removing the dummy gate very d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4899b076f949fdd87e740cbf0fdc56d
https://doi.org/10.31399/asm.cp.istfa2017p0380
https://doi.org/10.31399/asm.cp.istfa2017p0380
Autor:
Laura Safran, Stephen Lucarini, Sweta Pendyala, Timothy A. Brunner, David Clark, Zhigang Song, Weihao Weng, Karl Barth, Cathy Gow, Brett Engel, Anne Friedman, Bachir Dirahoui, Keliang He, Richard F. Hafer
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The ever-shrinking world of semiconductors has always challenged the interplay of tool capability, process integration, and characterization. The fine line between structural or electrical success and failure has steadily been redefined from microns
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eda614ab80ce5645d9bdaecded890391
https://doi.org/10.1109/asmc.2017.7969187
https://doi.org/10.1109/asmc.2017.7969187
Autor:
Cathy Gow, Edward Crawford, Yongchun Xin, Kan Zhang, Jang Sim, Fan Zheng, Dave Salvador, Rebekah Sheraw, Ben Stahl, Bryan Rhoads, Ishtiaq Ahsan, Brett Engel, Amanda L. Tessier, Xiao Pan, Brad Austin, Lori Kermel, William Davies
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In the state of the art development of chip manufacturing (FinFet technology for example) both optical inspection and inline electrical test are deployed to monitor and facilitate the process development. While optical inspection provides critical pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b735df40ec4c5974d6c4b406d8f530a
https://doi.org/10.1109/asmc.2016.7491094
https://doi.org/10.1109/asmc.2016.7491094