Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Catherine Shearer"'
Autor:
Maxwell J. Stone, Camilla J. Knight, Ross Hall, Catherine Shearer, Ross Nicholas, David A. Shearer
Publikováno v:
Sports Medicine. 53:803-806
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f449dfac4946a933cdc2a5f4486a735
https://doi.org/10.1007/s40279-023-01824-1
https://doi.org/10.1007/s40279-023-01824-1
Publikováno v:
Developing and Supporting Athlete Wellbeing ISBN: 9780429287923
Developing and Supporting Athlete Wellbeing
Developing and Supporting Athlete Wellbeing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c995e1176ee137332c70c6087638f50
https://doi.org/10.4324/9780429287923-3
https://doi.org/10.4324/9780429287923-3
Publikováno v:
Journal of Applied Sport Psychology. 34:155-177
The purpose of this study was to examine elite youth athletes’ knowledge, perceptions, and understanding of sport psychology, psychological characteristics, and psychological skills. To address thi...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74b0a715df996385a3ec90405da6637b
https://doi.org/10.1080/10413200.2020.1719556
https://doi.org/10.1080/10413200.2020.1719556
Autor:
Catherine Shearer
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:000226-000233
Interconnect materials for high operating temperature applications are becoming a limiting factor within the chain of materials. While materials such as capacitor dielectrics, semiconductor platforms (e.g. SiC), and baseplate materials (e.g. SiN comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5f9d4fc8a3dcd286e3fb531ce49622e
https://doi.org/10.4071/2380-4491.2017.hiten.226
https://doi.org/10.4071/2380-4491.2017.hiten.226
Autor:
Catherine Shearer
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-26
Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d303770eb353f9d5a7c1c02849b0f34
https://doi.org/10.4071/2017dpc-wp1_presentation5
https://doi.org/10.4071/2017dpc-wp1_presentation5
Autor:
Catherine Shearer
Publikováno v:
International Symposium on Microelectronics. 2016:000551-000556
MEMS devices are a segment of the electronics industry enjoying explosive growth. With the advent of the internet of things (IoT), the trajectory for growth will continue to be steep and price pressures on both the devices and packaging will be inten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ce2d306e7a818261f255c2315c7ec8c
https://doi.org/10.4071/isom-2016-thp11
https://doi.org/10.4071/isom-2016-thp11
Autor:
Catherine Shearer, Ken Holcomb
Publikováno v:
International Symposium on Microelectronics. 2015:000453-000458
High operating temperature electronics are a growing market in the electronics industry. Most of the components and substrates necessary to support the production of these harsh environment devices are now available, but the interconnect materials fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7238920a4df63a5057f28ad0962bc1d
https://doi.org/10.4071/isom-2015-wp44
https://doi.org/10.4071/isom-2015-wp44
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:001982-002014
The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the exterior surface of the PCB has become an increasingly diff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d888df7b6ef26004db5bc54a992540e8
https://doi.org/10.4071/2015dpc-tha22
https://doi.org/10.4071/2015dpc-tha22
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
Autor:
Mel Findlay, James Haley, Klaus-Jurgen Wolter, Peter J. Hesketh, Venky Sundaram, Catherine Shearer, Daniel Struk, Marc Papageorge, Rao Tummala, Chintan Buch
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 µm to 300 µm are used which limits overall form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4b4ac5a1c735201c35ed753f0fb54d1
https://doi.org/10.1109/ectc.2017.283
https://doi.org/10.1109/ectc.2017.283
Publikováno v:
The Sport Psychologist. 27:120-129
Interpersonal conflict is a common factor reported by governing bodies and their athletes when preparing for, or competing in, major games and championships (Olusoga, Butt, Hays, & Maynard, 2009). The aim of this study was to conduct a preliminary ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5548c09be9bf4f56346e94193139f65a
https://doi.org/10.1123/tsp.27.2.120
https://doi.org/10.1123/tsp.27.2.120