Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Casey Perkowski"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000083-000088
High temperature Silicon Carbide (SiC) integrated circuit (IC) processes have enabled devices that operate at >450°C for more than a year. These results have established the need for more advanced and practical packaging strategies. Off the shelf st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55b1d75c31d928bfa446eac8621afd18
https://doi.org/10.4071/2380-4491.2021.hitec.000083
https://doi.org/10.4071/2380-4491.2021.hitec.000083
Autor:
Kenneth Church, Justin Nussbaum, Nathan B. Crane, Harvey Tsang, Casey Perkowski, Clayton Neff, Patrick B. Nesbitt, Jing Wang, Juan Castro, Thomas M. Weller, Paul I. Deffenbaugh, Thomas P. Ketterl
Publikováno v:
Proceedings of the IEEE. 105:688-701
Direct digital manufacturing (DDM) is an emerging technology that is finding its place across a wide array of industries and applications as a cost-effective solution for low volume and mass customizable production. This technology encompasses a clas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7088b494155f81e1394ea0f35e1d707d
https://doi.org/10.1109/jproc.2017.2653178
https://doi.org/10.1109/jproc.2017.2653178
Autor:
Thomas M. Weller, Gokhan Mumcu, Merve Kacar, Kenneth Church, Casey Perkowski, Jing Wang, Bae-Ian Wu
Publikováno v:
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting.
This paper introduces a multilayer, wideband, high-efficiency, patch antenna with embedded cavity and monolithic microwave integrated circuit (MMIC) phase shifter using direct digital manufacturing (DDM). DDM platform combines fused deposition modeli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15010e59a633bf5a2d2c202d07dd9436
https://doi.org/10.1109/apusncursinrsm.2019.8888323
https://doi.org/10.1109/apusncursinrsm.2019.8888323
Autor:
Eduardo A. Rojas-Nastrucci, Nicholas Arnal, Paul I. Deffenbaugh, Yaniel Vega, Thomas M. Weller, Maria F. Cordoba-Erazo, Casey Perkowski, Thomas P. Ketterl, Mohamed M. Abdin, Kenneth Church, John W. I. Stratton
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 63:4382-4394
This paper reports on the design, fabrication and characterization of a 3-D printed RF front end for a 2.45 GHz phased array unit cell. The printed unit cell, which includes a circularly-polarized dipole antenna, a miniaturized capacitive-loaded open
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9250b14f463ddee2b407a80345c17793
https://doi.org/10.1109/tmtt.2015.2496180
https://doi.org/10.1109/tmtt.2015.2496180
Autor:
Merve Kacar, Casey Perkowski, Janice Booth, Thomas M. Weller, Paul I. Deffenbaugh, Gokhan Mumcu
Publikováno v:
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting.
Design and performance of a fully-printed Ku-band aperture coupled patch antenna manufactured by making use of a direct digital manufacturing (DDM) approach that integrates fused deposition of acrylonitrile butadiene styrene (ABS) thermoplastics with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7323f5e3172fb796afd8da30c831916a
https://doi.org/10.1109/apusncursinrsm.2017.8072664
https://doi.org/10.1109/apusncursinrsm.2017.8072664
Autor:
Thomas M. Weller, Yaniel Vega, John W. I. Stratton, Nicholas Arnal, Thomas P. Ketterl, Paul I. Deffenbaugh, Kenneth Church, Casey Perkowski
Publikováno v:
2015 IEEE MTT-S International Microwave Symposium.
Digital additive manufacturing (AM) is emerging as a promising technology for next-generation RF systems. AM processes that combine multiple materials in a single build and can produce volumetric designs are especially interesting for 3D structural e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c42399fa6cc14ee21a6ae3911b4b291
https://doi.org/10.1109/mwsym.2015.7167154
https://doi.org/10.1109/mwsym.2015.7167154