Laminate based LED module with embedded MOSFET chips.

Autor: Munding, A., Gruber, M., Both, T., Carrillo, J. Mena, Herfurth, M., Schmidt, H., Waldschik, A., Baur, E., Kaltenbacher, A., Hoge, M., Bergler, M.

Publikováno v: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-5, 5p