Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Carolin Henning"'
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 63:1-8
The paper gives a review of experiments for the application of biodegradable, sustainable polymers as a wiring board material. In the paper two different biobased materials and the standard PCB materials FR4 and FR2 were compared. The investigations
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90397ec24f3fd8b69969a212929978c1
https://doi.org/10.3311/ppee.13431
https://doi.org/10.3311/ppee.13431
Autor:
Reinhard Bauer, Cindy Ruckmar, Philipp Zink, Anna Schmid, Carolin Henning, Gunther Gobel, Kathrin Harre
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the production of PLA wiring substrates. Firstly, the heat distortion temperature of PLA is improved at higher temperatures by an annealing process. Double-sided PLA wiring carriers were realized by means of through-hole plating
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::518beb6e4ebeaaaccf895684c28401fb
https://doi.org/10.1109/isse49702.2020.9121011
https://doi.org/10.1109/isse49702.2020.9121011
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d0035b4173a5940ae1156e1a33eaecc
https://doi.org/10.1109/isse.2019.8810257
https://doi.org/10.1109/isse.2019.8810257
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
In the present paper the influences of design and technological preparation process of SMT test samples and the variation of parameters of shear tests on test results were examined. SMT samples with different sizes of electronic components (1206. 080
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdfc11e31ee52c02bfa2af9792938b3c
https://doi.org/10.1109/isse.2017.8001011
https://doi.org/10.1109/isse.2017.8001011
Publikováno v:
Periodica Polytechnica: Electrical Engineering & Computer Science; 2019, Vol. 63 Issue 1, p1-8, 8p