Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Carole Graas"'
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
The objective of this work is to use simulation results of a back end of line (BEOL) construction known to be susceptible to white bump failure to predict Chip package interaction (CPI) failure risk of other designs, prior to running a reliability qu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32d8b756ecb17eea556cbfbcfda1d486
https://doi.org/10.1109/estc.2018.8546392
https://doi.org/10.1109/estc.2018.8546392
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Cracks at the die edge induced by dicing can grow due to chip-package interaction (CPI) and thermal cycling experienced in service. The semiconductor industry has been making major efforts to prevent die edge cracks from propagating into the active a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c995f321eade772ca9f1048aeebfaca
https://doi.org/10.1109/ectc.2018.00340
https://doi.org/10.1109/ectc.2018.00340
Autor:
Yi Wanbing, E E Jan Khor, C.S. Premachandran, Fahad Mirza, Juan Boon Tan, Carole Graas, Patrick Justison, Fook Hong Lee
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Multi-layered systems are susceptible to cracking and or delamination upon temperature cycling. Passivation integrity test (PIT) is widely leveraged to assess and qualify the mechanical integrity of the passivation films (oxide, nitride) deposited on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e74758bcfe54c5885afcc7b46ad71cdd
https://doi.org/10.1109/ipfa.2016.7564315
https://doi.org/10.1109/ipfa.2016.7564315